Unlock instant, AI-driven research and patent intelligence for your innovation.

Conductive substrate

A technology of conductive substrates and transparent substrates, applied to conductive layers, electrical components, magnetic field/electric field shielding and other directions on an insulating carrier, which can solve the problem that the plane cannot be uniformly etched, dimensional deviation, and the inability to etch metal layers and blackened layers. And other issues

Active Publication Date: 2019-12-06
SUMITOMO METAL MINING CO LTD
View PDF5 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For this reason, if it is desired to etch the metal layer and the blackened layer at the same time, there is a case where neither layer can be etched into the target shape, and / or, uniform etching cannot be performed in the plane, resulting in dimensional deviations, Therefore, there is a problem that the metal layer and the blackened layer cannot be etched at the same time

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Conductive substrate
  • Conductive substrate
  • Conductive substrate

Examples

Experimental program
Comparison scheme
Effect test

experiment example 1

[0226] made with Figure 1A Conductive substrate of the structure shown.

[0227] (Metal layer forming step)

[0228] A metal layer was formed on one surface of a long transparent substrate made of polyethylene terephthalate resin (PET) having a length of 300 m, a width of 250 mm, and a thickness of 100 μm. It should be noted that the total light transmittance of a transparent substrate made of polyethylene terephthalate resin used as a transparent substrate was evaluated by the method specified in JIS K7361-1, and it was 97%. .

[0229] In the metal layer forming step, a metal thin film layer forming step and a metal plating layer forming step are carried out.

[0230] First, the metal thin film layer forming step will be described.

[0231] In the metal thin film layer forming step, the above-mentioned transparent base material was used as a base material, and a copper thin film layer was formed as a metal thin film layer on one surface of the transparent base material. ...

experiment example 2~ experiment example 10

[0247] In each experimental example, in addition to the nickel ion concentration in the blackening plating solution when forming the blackening layer, the current density of copper ion concentration, the blackening layer film formation and the plating time have been carried out as shown in table 1 Except for changing this point, a conductive substrate was produced and evaluated in the same manner as in Experimental Example 1. The results are shown in Table 1 and Table 2.

[0248] [Table 1]

[0249]

[0250] [Table 2]

[0251]

[0252] From the results shown in Table 2, it was confirmed that in any of Experimental Examples 1 to 10, the blackened layer contained simple nickel, nickel oxide, nickel hydroxide, and copper.

[0253] In addition, from the results shown in Table 1, even in terms of etching characteristics, the evaluation results were 0 or Δ, that is, it was confirmed that it is a conductive substrate having a metal layer and a blackened layer that can be etche...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle sizeaaaaaaaaaa
lengthaaaaaaaaaa
widthaaaaaaaaaa
Login to View More

Abstract

The present invention provides a conductive substrate which comprises a transparent base material, a metal layer that is formed on at least one surface of the transparent base material, and a blackening layer that is formed on the metal layer, and wherein the blackening layer is a roughening plating layer that contains a simple substance of nickel, a nickel oxide, a nickel hydroxide and copper.

Description

technical field [0001] The invention relates to a conductive substrate. Background technique [0002] The capacitive touch panel converts the position information of the approaching object on the panel surface into an electrical signal by detecting the change of the electrostatic capacity caused by the object approaching the panel surface. As for the conductive substrate used in the capacitive touch screen, it is disposed on the surface of the display, so the material of the conductive layer of the conductive substrate needs to have low reflectivity and is difficult to be recognized. [0003] Therefore, as the material of the conductive layer used in the conductive substrate for touch panels, a material with low reflectance and difficult to be seen is used, and is formed on a transparent substrate or a transparent film. [0004] For example, as described in Patent Document 1, conventionally, a transparent conductive film for a touch panel is used in which an ITO (indium oxi...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): B32B7/025B32B9/00B32B15/04G06F3/041G06F3/044H01B5/14H05K9/00
CPCB32B7/02B32B9/00B32B15/04H05K9/00H01B5/14G06F3/0445
Inventor 下地匠
Owner SUMITOMO METAL MINING CO LTD