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Adhesive composition, adhesive layer and protective film

A technology of adhesive layer and composition, applied in the direction of non-polymer adhesive additives, adhesive types, adhesive additives, etc., can solve the problems of reduced inspection, failure to suppress fragments, difficult application, etc., to achieve inspection Excellent performance, excellent laser processability, and the effect of suppressing the generation of chips

Pending Publication Date: 2019-12-10
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is necessary to irradiate the object to be processed with ultraviolet rays, and there is a problem that it is difficult to apply this method to an object to be processed that is not resistant to ultraviolet radiation (for example, there are many optical members such as polarizers).
In addition, since the haze of the protective film used in this method is not low enough, problems such as a decrease in inspection performance in the manufacturing process still occur.
Furthermore, the generation of debris itself cannot be suppressed

Method used

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  • Adhesive composition, adhesive layer and protective film
  • Adhesive composition, adhesive layer and protective film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0232] 100 parts by weight of the urethane prepolymer solution A obtained in Production Example 1 in terms of polymer solid content, and 3.4 parts by weight of an isocyanate-based crosslinking agent (trade name "CORONATE HX", manufactured by Tosoh Corp. Co., Ltd.), 0.5 parts by weight in terms of solid content of heat-resistant stabilizer (trade name "Irganox 1010", manufactured by BASF), 10 parts by weight in terms of solid content of silica dispersion liquid (trade name "MEK-EC-2130Y ", manufactured by Nissan Chemical Industry Co., Ltd.) was diluted with ethyl acetate so that the total solid content became 45% by weight, and the adhesive composition (1) was obtained.

[0233] The obtained adhesive composition (1) was applied to a base material made of polyester resin (trade name "T100-75S", thickness 75 μm, manufactured by Mitsubishi Chemical Corporation) so that the thickness after drying was 75 μm. , cured and dried at a drying temperature of 130°C and a drying time of 3 m...

Embodiment 2～6

[0237] By the same method as in Example 1, using the adhesive compositions (2) to (6) prepared by setting the type and the number of parts of the silica dispersion as described in Table 1, using the same method as in Example 1, Method got the protective film. Furthermore, evaluation was performed by the same method as in Example 1. The results are shown in Table 1.

Embodiment 7

[0239] Mix 4.4 parts of the urethane prepolymer solution A obtained in Production Example 1 and silica powder (trade name "HM-30S", manufactured by Tokuyama) in terms of polymer solid content to 100 parts by weight, and use a disperser to The mixture was stirred at 1500 rpm for 15 minutes, and the stirred urethane prepolymer solution was filtered through SUS400 mesh. 3.4 parts by weight of an isocyanate-based crosslinking agent (trade name "CORONATE HX", manufactured by Tosoh Corporation) in terms of solid content and 0.5 parts by weight of a heat-resistant stabilizer (trade name "Irganox 1010", manufactured by BASF), and 10 parts by weight of a silica dispersion in terms of solid content (trade name "MEK-EC-2130Y", manufactured by Nissan Chemical Industries, Ltd.) so that the total solid content becomes 45 parts by weight % was diluted with ethyl acetate to obtain an adhesive composition (7).

[0240] Using the obtained adhesive composition (7), a protective film was obtaine...

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Abstract

An object of the present invention is to provide an adhesive composition useful for a protective film which is excellent in laser processability, suppresses generation of debris, and is excellent in inspectability in a manufacturing process, an adhesive layer formed from such an adhesive composition, and a protective film having such an adhesive layer. The solution is that the adhesive compositionof the present invention, which contains a base polymer, includes metal oxide particles having an average primary particle diameter of 1 nm to 300 nm.

Description

technical field [0001] The present invention relates to adhesive compositions. The present invention relates to an adhesive layer formed from such an adhesive composition. The present invention relates to a protective film having such an adhesive layer. Background technique [0002] Laser dicing, in which processing is performed by irradiating laser light, is used for the division of semiconductor chips, etc., optical components, electronic components, etc. manufactured by dicing and division of semiconductor wafers. [0003] However, if laser cutting is performed, since the laser irradiation point becomes extremely high temperature, the material of the object to be processed is vaporized, etc., and debris (condensation) is generated, and the debris adheres to the surface of the object to be processed. If such debris adheres to the object to be processed, problems such as a decrease in the quality of the manufactured product, contamination of the production line, and a dec...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J175/04C09J11/04C09J7/25
CPCC08K2003/2227C08K2003/2241C08K2201/011C09J7/255C09J11/04C09J175/04C09J2301/122C09J2301/408C09J2467/006C09J2483/00C08K3/36C08K3/22
Inventor 越智元气高桥智一
Owner NITTO DENKO CORP
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