Silicon wafer cutting method and device
A cutting method and cutting device technology, applied in welding/welding/cutting items, laser welding equipment, manufacturing tools, etc., can solve problems such as trajectory deviation and poor quality, and achieve the effect of avoiding damage
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[0022] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described The embodiments are only some of the embodiments of the present invention, not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts shall fall within the protection scope of the present invention.
[0023] A first aspect of the present disclosure provides a silicon wafer dicing method, the dicing method comprising the following steps:
[0024] S1: prefabricating cracks on the surface of the silicon wafer;
[0025] S2: By adjusting the cutting platform, irradiate the laser emitted by the first laser emitting unit on the top of the ...
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