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A Tunable Magnetic Core tsv Inductor Based on tsv Vertical Switch

A vertical switch and inductor technology, applied in variable inductors, inductors, transformers/inductor cores, etc., can solve the problem that three-dimensional inductors can no longer be adjusted, so as to improve chip utilization and land occupation. The effect of small area and low loss

Active Publication Date: 2021-02-12
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an adjustable magnetic core TSV inductor based on a TSV vertical switch to solve the problem that the three-dimensional inductor cannot be adjusted once the inductance value is set

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  • A Tunable Magnetic Core tsv Inductor Based on tsv Vertical Switch
  • A Tunable Magnetic Core tsv Inductor Based on tsv Vertical Switch
  • A Tunable Magnetic Core tsv Inductor Based on tsv Vertical Switch

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Embodiment Construction

[0016] The technical solution of the present invention will be further described in detail below in conjunction with the description of the drawings and specific embodiments.

[0017] Such as figure 1 As shown, a TSV inductor with an adjustable magnetic core based on a TSV vertical switch of the present invention includes a silicon substrate 3, an upper silicon dioxide substrate 4 is arranged on the upper surface of the silicon substrate 3, and a lower silicon dioxide substrate is arranged on the lower surface of the silicon substrate 3. The silicon dioxide substrate 1, the upper silicon dioxide substrate 4 is embedded with an upper zigzag magnetic core 5, and the lower silicon dioxide substrate 1 is embedded with a lower zigzag magnetic core 2. combine figure 2 and image 3 , a control inductance L is sequentially arranged between the four groups of corresponding sides formed by the upper zigzag magnetic core 5 and the lower zigzag magnetic core 2 ctrl , inductance L 1 ,...

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Abstract

The invention discloses an adjustable magnetic core TSV inductor based on a TSV vertical switch, comprising a silicon substrate, an upper silicon dioxide substrate is arranged on the upper surface of the silicon substrate, and a lower silicon dioxide substrate is arranged on the lower surface of the silicon substrate , the upper back-shaped magnetic core is embedded in the upper silicon dioxide substrate, the lower back-shaped magnetic core is embedded in the lower silicon dioxide substrate, and the upper back-shaped magnetic core and the lower back-shaped magnetic core are formed Control inductance L is sequentially arranged between the four groups of corresponding sides ctrl , inductance L 1 , inductance L 2 and inductance L 3 , where the inductance L 1 of the output terminal with the inductor L 2 connected to the input, the inductor L 2 of the output terminal with the inductor L 3 TSV vertical switch is set in the upper back-shaped magnetic core and the lower back-shaped magnetic core, and the source of the TSV vertical switch is connected to the inductance L 1 connected to the output of the TSV vertical switch with the drain of the inductor L 3 input connection.

Description

technical field [0001] The invention belongs to the technical field of electrical equipment, and in particular relates to an adjustable magnetic core TSV inductor based on a TSV vertical switch. Background technique [0002] As an important passive device, an inductor has the functions of suppressing electromagnetic wave interference, blocking current, filtering, filtering signals, filtering noise, and stabilizing current. The traditional on-chip inductor adopts a planar spiral structure, which not only occupies a large chip area, but also has high loss, and it is difficult to improve the quality factor. In three-dimensional integrated circuits, the use of through-silicon vias (TSVs) not only improves integration, but also reduces data transmission loss, but there is still no good solution for passive devices such as inductors, and because of process consistency And heat dissipation problems, it is necessary to do a lot of dummy TSVs to ensure the stability of the environme...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01F27/26H01F27/30H01F29/00
CPCH01F27/26H01F27/306H01F29/00
Inventor 王凤娟陈佳俊余宁梅
Owner XIAN UNIV OF TECH