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MEMS sound sensor, MEMS microphone and electronic equipment

A sound sensor and sound sensing technology, applied in the field of microphones, can solve the problems of low sensitivity, inability to detect sound, and unfavorable product miniaturization.

Active Publication Date: 2019-12-13
SHANDONG GETTOP ACOUSTIC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Traditional MEMS sound sensors usually can only work in scenes with low environmental noise. Once the environmental noise increases, the expected sound cannot be detected, and other sensors need to be added to work, which is not conducive to the miniaturization of products
And the sensitivity of the traditional MEMS sound sensor is low, which cannot meet the needs of users

Method used

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  • MEMS sound sensor, MEMS microphone and electronic equipment
  • MEMS sound sensor, MEMS microphone and electronic equipment
  • MEMS sound sensor, MEMS microphone and electronic equipment

Examples

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Embodiment Construction

[0019] figure 1 It is a structural schematic diagram of a MEMS acoustic sensor in an embodiment. figure 1 It is a structural schematic diagram of a MEMS acoustic sensor in an embodiment. The MEMS acoustic sensor can also be referred to as a MEMS sensor or a MEMS chip. The MEMS acoustic sensor includes a substrate 110 , a first acoustic sensing unit 200 formed on the substrate 110 , and a second acoustic sensing unit 300 formed on the substrate 110 . The first sound sensing unit 200 and the second sound sensing unit 300 are electrically insulated from each other. Wherein, the first sound sensing unit 200 can be used to detect sound through at least one of air sound pressure changes and mechanical vibrations, that is, the first sound sensing unit 200 can detect air sound pressure changes caused by sound Sound detection can be realized through sound detection, and sound detection can also be realized through the vibration caused by sound or mechanical external force. It can b...

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PUM

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Abstract

A MEMS sound sensor includes: a substrate; a first sound sensing unit and a second sound sensing unit arranged on the substrate, wherein the first sound sensing unit is used for detecting sound through at least one of air sound pressure change and mechanical vibration, and the first sound sensing unit comprises a first back plate arranged above the substrate; a first vibrating diaphragm arranged opposite to the first back plate, wherein a gap exists between the first vibrating diaphragm and the first back plate and the first vibrating diaphragm and the first back plate form a capacitor structure; a first connecting column, wherein a second end of the first connecting column is fixedly connected with the first back plate and the first vibrating diaphragm is fixedly supported on the first back plate. At least one mass block is arranged in the edge area of the first vibrating diaphragm; a gap exists between the mass block and the first back plate.

Description

technical field [0001] The invention relates to the technical field of microphones, in particular to a MEMS sound sensor and a preparation method thereof, a MEMS microphone and electronic equipment. Background technique [0002] MEMS (Micro-Electro-Mechanical System, Micro-Electro-Mechanical System) microphone is an electric transducer manufactured based on MEMS technology, which has the advantages of small size, good frequency response characteristics and low noise. With the miniaturization of electronic devices, MEMS microphones are more and more widely used in these devices. The MEMS sound sensor is a key device in the MEMS microphone, and its performance directly affects the performance of the entire MEMS microphone. Traditional MEMS sound sensors usually can only work in scenes with low environmental noise. Once the environmental noise increases, the desired sound cannot be detected, and other sensors need to be added to work, which is not conducive to the miniaturizat...

Claims

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Application Information

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IPC IPC(8): H04R19/04B81B7/02
CPCB81B7/02H04R19/04
Inventor 何宪龙谢冠宏邱士嘉
Owner SHANDONG GETTOP ACOUSTIC
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