Evaporation plating device, evaporation source and spray nozzle
A technology of evaporation source and nozzle, which is applied in the field of evaporation equipment, and can solve problems such as poor film uniformity
Active Publication Date: 2019-12-20
BOE TECH GRP CO LTD +1
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Problems solved by technology
[0006] The current evaporation equipment is limited by its nozzle structure and nozzle arrangement. While reducing the shadow of film formation, it will cause problems such as poor film formation uniformity. Therefore, it is urgent to propose an evaporation equipment that can reduce the film formation. shadow while avoiding other undesirable
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[0032] The technical solution of the present application will be further described below in conjunction with the accompanying drawings and through specific implementation methods. It should be understood that the specific embodiments described here are only used to explain the present application, but not to limit the present application.
[0033] Generally, two aspects are mainly considered in the design of the evaporation source nozzle: 1. The uniformity of the thickness of the evaporated film layer, which is mainly determined by the mechanical structure design of the nozzle and the linear arrangement of the nozzle. Two: During evaporation, due to the shadow of film formation caused by the existence of the mask, reducing the shadow of film formation is also an important aspect to be considered in the mechanical structure design of the nozzle.
[0034] During evaporation, the film-forming shadow (shadow) caused by the existence of the mask is the main aspect that needs to be ...
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Abstract
The invention relates to an evaporation plating device, an evaporation source and a spray nozzle, and relates to the technical field of evaporation plating devices. The spray nozzle comprises a spraynozzle body, wherein the spray nozzle body is provided with an outlet end face for spraying out evaporation gas, and a certain included angle exists between the outlet end face and a cross section, perpendicular to the central axis, of the spray nozzle body. The evaporation source comprises a crucible and a group of spray nozzles arranged on the crucible and distributed on a straight line, whereinthe group of the spray nozzles comprise a plurality of inclined spray nozzles, and the outlet end faces of all the inclined spray nozzles in the group of the spray nozzles face the direction back onto the central position of the group of the spray nozzles. The evaporation source can reduce the number of film formation shadows caused due to existence of mask plates in the evaporation plating process.
Description
technical field [0001] The present application relates to the technical field of evaporation devices, in particular to an evaporation device, an evaporation source and a nozzle. Background technique [0002] Forming OLED (Organic Light Emitting Diode) devices on a substrate usually adopts an evaporation process, which refers to heating the evaporation material under a certain vacuum condition, so that the evaporation material is melted (or sublimated) into a vapor composed of atoms, molecules or atomic groups, Then condense to form a film on the surface of the substrate, thereby forming the functional layer of the OLED device. [0003] The evaporation process can be divided into point source evaporation and line source evaporation according to the type of evaporation source (heating device for evaporation materials). For line source evaporation, the material is heated, sprayed from the nozzle of the crucible, and deposited on the substrate to form a film layer. The linear ...
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IPC IPC(8): C23C14/24H01L51/56
CPCC23C14/24H10K71/00
Inventor 饶勇李有亮肖昂刘金彪谭瑞
Owner BOE TECH GRP CO LTD