Cleaning and laminating all-in-one machine for ceramic disc and wafer

Abstract

The invention discloses a cleaning and laminating all-in-one machine for a ceramic disc and a wafer. The all-in-one machine comprises a cleaning device, at least one group of laminating devices and afeeding device positioned on one side of the laminating devices, wherein the cleaning device comprises a feeding station, a cleaning station, a discharging station and a first material moving assembly; the laminating device is located on one side of the cleaning device and is in butt joint with the cleaning device through a material taking assembly; the laminating device comprises a preheating station, a laminating station, a cooling station, a discharging station and a second material moving assembly; feeding devices and the laminating devices are consistent in number and correspond in a one-to-one mode; and each feeding device comprises a storage station, a washing station, a wax throwing station, a baking station, an overturning station and a mechanical arm structure. The cleaning operation of the ceramic disc and the processing operation of a sapphire wafer can be carried out at the same time, then the processed sapphire wafer is laminated to the surface of the ceramic disc, and therefore the laminating efficiency of the sapphire wafer is greatly improved.

Description

technical field [0001] The invention belongs to the technical field of sapphire wafer processing, and in particular relates to an integrated machine for cleaning and laminating ceramic discs and wafers. Background technique [0002] At present, with the rapid development of the electronics industry, the processing accuracy of products needs to be gradually improved, and the processing process is becoming more and more refined, and the quality requirements are also getting higher and higher. [0003] For sapphire wafers, the flatness of the wafer surface is an extremely important quality parameter. During the placement operation of sapphire wafers, the flatness of the placement and the surface treatment of the sapphire wafer will directly affect the quality of the sapphire wafer placement. The bonding effect after being bonded to the surface of the ceramic disc. [0004] In order to improve the flatness of the surface of the ceramic disc, it is usually necessary to clean the...

AI Technical Summary

Problems solved by technology

[0004] In order to improve the flatness of the surface of the ceramic disc, it is usually necessary to clean the ceramic disc. The traditional cleaning method is manual cleaning, that is, the operator fixes the ceramic disc and then scrubs the ceramic disc. This cleaning method requires a lot of manpower , the cleaning effect is poor, it is easy to cause damage to the ceramic plate, and it is easy to cause secondary pollution during the manual handling process, and the manual cleaning method is inefficient and difficult to meet the needs of modern high-speed production

[0005] At the same time, for the treatment of the sapphire surface, the traditional treatment method is manual operation, that is, the polishing wax is manually applied to the surface of the sapphire wafer, and then the sapphire wafer is bonded to the ceramic plate. This bonding method has relatively high technical requirements for workers. High, and low efficiency, unstable quality, easy to lead to low yield

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