Cleaning and laminating all-in-one machine for ceramic disc and wafer

An all-in-one, ceramic disk technology, applied in semiconductor/solid-state device manufacturing, electrical components, circuits, etc., can solve the problems of high labor consumption, unstable quality, and high technical requirements of workers, to meet modern high-speed production and reduce manual labor. Intensity, the effect of guaranteeing the treatment effect
CN110600406APending Publication Date: 2019-12-20拓思精工科技(苏州)有限公司
0 Cites 3 Cited by

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
拓思精工科技(苏州)有限公司
Publication Date
2019-12-20

Smart Images

  • Figure 1
    Figure 1
  • Figure 2
    Figure 2
  • Figure 3
    Figure 3
Patent Text Reader

Abstract

The invention discloses a cleaning and laminating all-in-one machine for a ceramic disc and a wafer. The all-in-one machine comprises a cleaning device, at least one group of laminating devices and afeeding device positioned on one side of the laminating devices, wherein the cleaning device comprises a feeding station, a cleaning station, a discharging station and a first material moving assembly; the laminating device is located on one side of the cleaning device and is in butt joint with the cleaning device through a material taking assembly; the laminating device comprises a preheating station, a laminating station, a cooling station, a discharging station and a second material moving assembly; feeding devices and the laminating devices are consistent in number and correspond in a one-to-one mode; and each feeding device comprises a storage station, a washing station, a wax throwing station, a baking station, an overturning station and a mechanical arm structure. The cleaning operation of the ceramic disc and the processing operation of a sapphire wafer can be carried out at the same time, then the processed sapphire wafer is laminated to the surface of the ceramic disc, and therefore the laminating efficiency of the sapphire wafer is greatly improved.
Need to check novelty before this filing date? Find Prior Art

Description

technical field

[0001] The invention belongs to the technical field of sapphire wafer processing, and in particular relates to an integrated machine for cleaning and laminating ceramic discs and wafers. Background technique

[0002] At present, with the rapid development of the electronics industry, the processing accuracy of products needs to be gradually improved, and the processing process is becoming more and more refined, and the quality requirements are also getting higher and higher.

[0003] For sapphire wafers, the flatness of the wafer surface is an extremely important quality parameter. During the placement operation of sapphire wafers, the flatness of the placement and the surface treatment of the sapphire wafer will directly affect the quality of the sapphire wafer placement. The bonding effect after being bonded to the surface of the ceramic disc.

[0004] In order to improve the flatness of the surface of the ceramic disc, it is usually necessary to clean the...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More