Camera sensing assembly and manufacturing method thereof
A manufacturing method and camera-sensing technology, applied to electrical components, electrical solid devices, semiconductor devices, etc., can solve problems such as unfavorable yield rate and reduced yield, and achieve the effects of reducing stress, improving production efficiency, and preventing overflow
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[0032] The idea of the present invention is to design a camera sensing component that can improve yield rate and production efficiency. The basic idea is to use two bonding parts for thermocompression bonding and use an air gap to prevent delamination and peeling problems caused by stress. Specifically Examples will be described in the following.
[0033] see figure 1 , the camera sensing assembly of this embodiment is obtained by bonding a first bonding portion and a second bonding portion, wherein, the first bonding portion, the first bonding portion includes a semiconductor substrate 1, a spacer 4 and cover glass 5. The semiconductor substrate 1 is a traditional silicon material, which is cut from a semiconductor wafer, and has pads 3 and sensor chip regions 2 on its upper surface, and the pads 3 are connected to the sensor chip region 2 .
[0034] The cover glass 5 is adhered on the upper surface of the semiconductor substrate 1 through the spacer 4 . Wherein, the cov...
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