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Dust removing equipment for polyimide film

A technology of polyimide film and dust removal equipment, which is applied in the direction of thin material treatment, electrostatic cleaning, cleaning methods and utensils, etc., can solve the problems of easy adhesion of dust, etc., to increase the adsorption effect, increase the adsorption capacity, increase The effect of mobility

Active Publication Date: 2020-01-03
中汇睿能凤阳新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a dust removal device for polyimide film, which solves the problem of easy adhesion of dust during the transmission of the existing polyimide film production

Method used

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  • Dust removing equipment for polyimide film
  • Dust removing equipment for polyimide film
  • Dust removing equipment for polyimide film

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] Such as Figure 1-3 As shown, the present invention provides a technical solution: a dust removal device for polyimide film, including two support bases 1, three rotating rods 2 are movably connected to the opposite sides of the two supporting bases 1, and the three rotating rods 2. The first processing roller 5, the second processing roller 4 and the third processing roller 3 are sleeved sequentially from top to bottom;

[0024] When the polyimide fil...

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Abstract

The invention discloses dust removing equipment for polyimide film. The dust removing equipment comprises two supporting seats, and three rotating rods are movably connected to the opposite sides of the two supporting seats. During usage, an electric corona ring is powered on to generate an electrostatic field, gas ionization occurs through the electrostatic field, and thus dust particles are charged and are attracted to electrodes for dust collection; a heating device is disposed in a drying fan, so that the drying property of the electrostatic field is guaranteed, the dust sucking capacity is improved, and the gas flow mobility is further improved; during usage, the dust sucking effect can be improved, and thus the dust around the polyimide film can be effectively removed; and two dust removing devices are distributed on the upper side and the lower side of the polyimide film up and down, air molecules are ionized into positive ions and electrons in a strong electric field, the electrons encounter the dust particles while the electrons head to the positive electrode, then the dust particles are negatively charged and are attracted to a positive plate to be collected, the dust canbe attracted to the surface of the positive plate, and the nearby dust can be effectively isolated and removed.

Description

technical field [0001] The invention relates to the technical field of dust removal equipment for polyimide films, in particular to a dust removal equipment for polyimide films. Background technique [0002] Polyimide film is one of the earliest products of polyimide, which is used for slot insulation of motors and wrapping materials for cables. The polyamic acid solution is cast into a film, stretched, and then imidized at high temperature. The film is yellow and transparent, with a relative density of 1.39-1.45. It has outstanding high temperature resistance, radiation resistance, chemical corrosion resistance and electrical insulation performance. It can be used for a long time in the air at 250-280 °C. The glass transition temperatures are 280°C (Upilex R), 385°C (Kapton) and above 500°C (Upilex S). The tensile strength is 200MPa at 20°C and greater than 100MPa at 200°C. It is especially suitable as the substrate of flexible printed circuit boards and insulating mater...

Claims

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Application Information

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IPC IPC(8): B65H23/26B65H27/00B08B1/02B08B6/00
CPCB65H23/26B65H27/00B08B6/00B65H2301/5115B65H2701/1752B08B1/20
Inventor 王文静
Owner 中汇睿能凤阳新材料科技有限公司
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