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A kind of dust removal equipment for polyimide film

A technology of polyimide film and dust removal equipment, applied in thin material processing, electrostatic cleaning, cleaning methods and utensils, etc., can solve the problem of easy adhesion of dust, etc., to increase the adsorption effect, increase the adsorption capacity, increase the The effect of liquidity

Active Publication Date: 2021-01-15
中汇睿能凤阳新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides a dust removal device for polyimide film, which solves the problem of easy adhesion of dust during the transmission of the existing polyimide film production

Method used

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  • A kind of dust removal equipment for polyimide film
  • A kind of dust removal equipment for polyimide film
  • A kind of dust removal equipment for polyimide film

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Embodiment Construction

[0022] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0023] Such as Figure 1-3 As shown, the present invention provides a technical solution: a dust removal device for polyimide film, including two support bases 1, three rotating rods 2 are movably connected to the opposite sides of the two supporting bases 1, and the three rotating rods 2. The first processing roller 5, the second processing roller 4 and the third processing roller 3 are sleeved sequentially from top to bottom;

[0024] When the polyimide fil...

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Abstract

The invention discloses a dust removal equipment for polyimide film, which includes two support seats, and three rotating rods are movably connected to the opposite sides of the two support seats. When the invention is in use, the corona ring is energized to generate an electrostatic field, and the electrostatic field is used to ionize the gas so that the dust particles are charged and adsorbed to the dust collector on the electrode. A heating device is provided in the drying fan to ensure the dryness of the electrostatic field and increase It improves the dust adsorption capacity and increases the fluidity of the air flow. When used, it can increase the dust adsorption effect, thereby ensuring that the dust around the polyimide film can be effectively removed. The two dust removal devices are distributed up and down on the polyimide film. On the upper and lower sides of the imine film, air molecules are ionized into positive ions and electrons in the strong electric field. When the electrons run towards the positive electrode, they encounter dust particles, causing the dust particles to be negatively charged and adsorbed to the positive plate for collection. The dust can be adsorbed on the positive plate. The surface of the positive plate can effectively isolate and clean nearby dust.

Description

technical field [0001] The invention relates to the technical field of dust removal equipment for polyimide films, in particular to a dust removal equipment for polyimide films. Background technique [0002] Polyimide film is one of the earliest products of polyimide, which is used for slot insulation of motors and wrapping materials for cables. The polyamic acid solution is cast into a film, stretched, and then imidized at high temperature. The film is yellow and transparent, with a relative density of 1.39-1.45. It has outstanding high temperature resistance, radiation resistance, chemical corrosion resistance and electrical insulation performance. It can be used for a long time in the air at 250-280 °C. The glass transition temperatures are 280°C (Upilex R), 385°C (Kapton) and above 500°C (Upilex S). The tensile strength is 200MPa at 20°C and greater than 100MPa at 200°C. It is especially suitable as the substrate of flexible printed circuit boards and insulating mater...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B65H23/26B65H27/00B08B1/02B08B6/00B08B1/20
CPCB65H23/26B65H27/00B08B6/00B65H2301/5115B65H2701/1752B08B1/20
Inventor 王文静
Owner 中汇睿能凤阳新材料科技有限公司
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