Architecture for silicon photonics enabling wafer probe and test

Abstract

Embodiments herein describe techniques for testing or aligning optical components (205, 225) in a photonic chip (200) using a grating coupler (220). In one embodiment, the photonic chip (200) may include an edge coupler (205) and a grating coupler (220) for optically coupling the photonic chip to external fiber optic cables (920). The edge coupler (205) may be disposed on a side or edge of the photonic chip while the grating coupler (220) is located on a top or side of the photonic chip. During fabrication, the edge coupler (205) may be inaccessible. Instead of using the edge coupler (205) totest the photonic chip, a testing apparatus (805) can use the grating coupler (220) along with a splitter (215) to transfer optical test signals between an optical component in the photonic chip (e.g., a modulator or detector) and a test probe (505) optically coupled to the grating coupler (220).

Description

technical field [0001] Examples of the present disclosure relate generally to testing optical components in photonic chips, and in particular, to using grating couplers to verify the functionality of optical components integrated into photonic chips. Background technique [0002] Many network devices process data at rates that cannot be achieved using conductive cables. For example, the I / O rate of a network device may mean that using conductive cables (eg, Ethernet cables) requires too much power or introduces too much noise. So, if high-speed signals need to be passed between network devices, the devices can use fiber optic cables, which can accommodate much higher data rates over greater distances than conductive cables. [0003] A network device may include one or more photonic chips coupled to an optical cable. For example, photonic chips can be coupled to hundreds of different fiber optic cables. But it is difficult, if not impossible, to test the optical components...

AI Technical Summary

Problems solved by technology

However, it is difficult, if not impossible, to test the optical components in a photonic chip before it is mounted and aligned with the fiber optic cable

For example, it may not be possible to test optical components (e.g., optical modulators, optical detectors, etc.) in a photonic chip while the photonic chip is still in the wafer (i.e., before the wafer is sawn into individual photonic chips)

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