System-level power supply integrity design method for packaging and printed board

Abstract

The invention discloses a system-level power supply integrity design method for packaging and a printed board. The method comprises two levels of DC power supply voltage drop and AC frequency domain impedance. Porous connection of a packaging power supply ground is designed, a printed board thick copper foil power supply ground layer pair is adopted, and a graded filter capacitor configuration method combining a packaging-level low-inductance filter capacitor and a printed board-level medium-high-capacitance filter capacitor is adopted. According to the invention, the current-carrying characteristic of the packaging and printed board is improved, the DC voltage drop of the packaging and printed board power distribution system is reduced, the frequency domain impedance of the power distribution system is effectively reduced, the number of printed board-level low-capacitance filter capacitors can be reduced, and the layout and wiring space of the board surface of the printed board is saved.

Description

technical field [0001] The invention relates to the field of power integrity design, in particular to a system-level power integrity design method for packaging and printed boards. Background technique [0002] With the continuous improvement of integration, operating frequency and computing performance of VLSI chips, the operating power consumption of the system continues to increase. decrease. The power supply voltage drop and power supply fluctuation caused by the power supply current fluctuation will inevitably have a certain impact on the stable operation of the system. In order to solve the problems of power voltage drop and power noise in the power system, it is necessary to carry out research on power integrity design technology. [0003] In order to ensure the stable and reliable operation of the system, the power integrity design has become a crucial link in the system design, and the power integrity design technology has also become a research hotspot in the ind...

AI Technical Summary

Problems solved by technology

[0004] However, the existing power integrity design technology introduced in the above literature only considers the printed circuit board, and does not consider the power distribution network of the package. Design analysis

At the same time, when this technology is analyzed, it only focuses on considering the AC frequency domain impedance and optimizing the frequency domain impedance of the power distribution system, so there are certain limitations.

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