Layered body of polyimide film and inorganic substrate

A technology of polyimide film and inorganic substrate, applied in the direction of coating, lamination, layered products, etc., can solve the problem of not being able to improve the yield of functional components

Active Publication Date: 2020-01-17
TOYOBO CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, even with high-quality polymer films and further cleaning, however, defects remain on the polymer film surface, which generally does not improve the yield of functional device fabrication

Method used

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  • Layered body of polyimide film and inorganic substrate
  • Layered body of polyimide film and inorganic substrate
  • Layered body of polyimide film and inorganic substrate

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0113] Hereinafter, although an Example and a comparative example demonstrate this invention more concretely, this invention is not limited to the following Example. In addition, the evaluation methods, processing methods, operation methods, etc. of the physical properties in the following examples are as follows.

[0114]

[0115] The polymer was dissolved in N-methyl-2-pyrrolidone (or N,N-dimethylacetamide) in such a way that the polymer concentration was 0.2 g / dl, using an Ubbelohde viscometer at 30 °C Assay solution. (When the solvent used for the preparation of the polyamic acid solution is N,N-dimethylacetamide, the polymer is dissolved using N,N-dimethylacetamide and measured.)

[0116]

[0117] For the polyimide film, the film thickness was determined by SEM cross-sectional observation of the cross-section of the laminated body. In addition, unless otherwise stated, the average value of the film thickness of 5 randomly selected places in the area|region from the ...

manufacture example

[0148] [Manufacture of polyimide precursor (polyamic acid) solution PV1]

[0149] After substituting nitrogen gas into the reaction vessel equipped with nitrogen gas introduction tube, thermometer and stirring rod, add 223 parts by mass of 5-amino-2-(p-aminophenyl) benzoxazole, 4416 parts by mass of N,N-dimethylacetamide After completely dissolving it, 217 parts by mass of pyromellitic dianhydride was added and stirred for 24 hours at a reaction temperature of 25° C. to obtain a brown viscous polyamic acid solution [PV1].

[0150] [Manufacture of polyimide precursor (polyamic acid) solution PV2]

[0151] After substituting nitrogen gas into the reaction vessel equipped with a nitrogen gas introduction tube, a thermometer, and a stirring bar, 398 parts by mass of 3,3',4,4'-biphenyltetracarboxylic dianhydride as tetracarboxylic dianhydride, terephthalic dianhydride Dissolve 132 parts by mass of amine and 30 parts by mass of 4,4'-diaminodiphenyl ether in 4600 parts by mass of N,...

Embodiment 1

[0193] The polyimide film [PF1a] which is a polyimide film is plasma-treated, and the polyimide film is overlapped with the silane coupling agent-treated surface of the inorganic substrate treated with the silane coupling agent, After temporarily crimping with a roller laminator, set it in a clean workbench, place it on a hot plate whose temperature is adjusted to 150°C in such a way that the inorganic substrate side is in contact with the hot plate, and perform heat treatment for 3 minutes to obtain polyamide A laminate of an imide film and an inorganic substrate. The obtained laminate of the polyimide film and the inorganic substrate was stored in an environment with a temperature of 20 to 25° C. and a relative humidity of 65±30% for 12 hours or more.

[0194] The obtained laminate of the polyimide film and the inorganic substrate was heat-treated in an inert furnace at 450° C. for 30 minutes. Take it out from the furnace, place it on a separately prepared copper plate whos...

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Abstract

The present invention addresses the problem of providing a layered body of a polyimide film and an inorganic substrate, which is useful for high-yield production of flexible electronic devices comprising fine device arrays such as organic EL display elements. This layered body of a polyimide film and an inorganic substrate is obtained by: washing and cleaning a polyimide film and an inorganic substrate sufficiently to remove foreign matter formed of inorganic substances; bonding the polyimide film and the inorganic substrate together to construct a layered body; subjecting the layered body toa heat treatment at a temperature of at least 350 DEG C but less than 600 DEG C and then to rapid cooling to carbonize and shrink organic foreign matter. By the rapid cooling of the air inside of blisters, blister height is reduced. The number density of blister defects containing carbides is 50 counts / square meter or less, the average blister height is 2 [mu]m or less, and the product of the number density of blisters (counts / square meter) and the average height of the blisters ([mu]m) is 20 or less.

Description

technical field [0001] The present invention relates to a laminated body of a polyimide film and an inorganic substrate such as glass. In further detail, the polyimide film is laminated on the inorganic substrate to temporarily support a flexible polyimide film, and on the polyimide film A laminate of a polyimide film and an inorganic substrate that is used to manufacture flexible functional elements using a polyimide film as a substrate, after the polyimide film is peeled off from the inorganic substrate after manufacturing and processing functional components such as electronic equipment . Background technique [0002] In recent years, for the purpose of reducing weight, miniaturization, thinning, and flexibility of functional elements such as semiconductor elements, MEMS elements, display elements, and wearable sensors, technological development of forming these elements on polymer films has been actively carried out. That is, as materials for so-called electronic compon...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/34
CPCB32B17/10B32B37/0007B32B2457/14H01L2221/68327H01L2221/68381H01L2221/68318H01L21/6836B32B27/281B32B2255/10B32B27/16B32B2250/02B32B2262/105B32B5/02B32B2457/12B32B15/08B32B2457/20B32B2255/26B32B2307/30B32B2262/103B32B2307/732B32B27/12B32B9/045B32B9/005B32B2307/538B32B2262/101B32B7/12B32B37/12B32B2037/1253B32B38/0036B32B38/10B32B2250/03B32B2255/24B32B2307/50B32B2309/02B32B2310/0409B32B2379/08B32B2457/206
Inventor 山下全广奥山哲雄土屋俊之渡边直树德田桂也原彰太
Owner TOYOBO CO LTD
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