Mobile phone backboard manufacturing method
A production method and backplane technology, which are applied to household components, household appliances, other household appliances, etc., can solve the problems of insufficient heat dissipation, difficult to meet the heat dissipation requirements of mobile phones, etc., to ensure the service life and enhance the effect of heat dissipation.
Inactive Publication Date: 2020-01-31
合肥领盛电子有限公司
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Problems solved by technology
In order to meet users' requirements for personalized products, businesses in the industry have developed various shell components with unique functions and different shapes. With the rise of electronic products, the design and processing technology of corresponding parts have also been greatly developed, and the practicability is becoming more and more It is getting stronger and stronger, and the mobile phone backplane made by the current mobile phone backplane production method also has insufficient heat dissipation, and it is difficult to meet the heat dissipation requirements of mobile phones with increasing performance, so it needs to be improved in a targeted manner
Method used
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Embodiment Construction
[0014] The embodiments described in this case are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0015] The invention provides a method for manufacturing a mobile phone backplane, comprising the following steps,
[0016] S1, apply epoxy resin on the surface of the graphite film, then stack the treated graphite film, put it into a hot press, and form a graphite film / epoxy resin layered prefabricated plate under the action of pressure and temperature;
[0017] S2. Drill the prefabricated board in S1 and soak it in epoxy resin to obtain a graphite film / epoxy resin layered composite board; ensure that the molten epoxy resin can enter the gap between each graphite film layer, and the multilayer The graphite films are stacked together and solidified i...
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Abstract
The invention discloses a mobile phone backboard manufacturing method. The mobile phone backboard manufacturing method comprises the following steps that S1, the surface of a graphite film is coated with epoxy resin, then the treated graphite film is stacked and put into a hot press, and a graphite film / epoxy resin layered prefabricated plate is formed under the action of pressure and temperature;S2, the prefabricated plate in the step S1 is punched and then soaked in the epoxy resin, and a graphite film / epoxy resin layered composite plate is obtained; S3, the two side faces of the compositeplate in the step S2 are plated with copper layers through an electroplating process; S4, the composite plate manufactured in the step S3 is placed in a mold, and a prefabricated plate of a mobile phone backboard is manufactured through an injection molding process; and S5, the prefabricated plate in the step S4 is cut, polished and painted, and a finished product collection backboard is obtained.According to the method, a base plate and the graphite film / epoxy resin layered composite plate obtained after electroplating treatment are combined, the heat dissipation effect of the mobile phone backboard is greatly enhanced, and the service life of internal elements of a mobile phone is prolonged.
Description
technical field [0001] The invention belongs to the technical field of mobile phone back panels, and in particular relates to a method for manufacturing a mobile phone back panel. Background technique [0002] Mobile devices such as mobile phones and PADs have become necessities in modern life, so the market for their supporting parts is becoming more and more mature. In order to meet users' requirements for personalized products, businesses in the industry have developed various shell components with unique functions and different shapes. With the rise of electronic products, the design and processing technology of corresponding parts have also been greatly developed, and the practicability is becoming more and more It is getting stronger and stronger, and the mobile phone backplane made by the currently used mobile phone backplane manufacturing method also has insufficient heat dissipation, and it is difficult to meet the heat dissipation requirements of mobile phones with...
Claims
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IPC IPC(8): B29C43/20B29C43/18B29C45/14C25D5/54B29L31/34
CPCB29C43/18B29C43/206B29C45/14B29C2045/14868B29L2031/3406C25D5/54
Inventor 王忠雷魏雪
Owner 合肥领盛电子有限公司