Printable composite molding bottom film and preparation method thereof
A composite molding and bottom film technology, which is applied in chemical instruments and methods, synthetic resin layered products, flat products, etc. Water volume, effects to fix cursor tracking issues
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Examples
Embodiment 1
[0043] The printable composite molding base film structure of this embodiment is from top to bottom: CPP layer, printing layer (ink), adhesive layer (TIE), PA layer, barrier layer and heat-sealing layer, wherein:
[0044] The CPP layer is made of CPP produced by Xiantao Huishi Plastic Industry Co., Ltd., with a thickness of 30 μm;
[0045] The printing layer is made of UMT99-F boiled series ink produced by Suzhou Zhongya Ink Co., Ltd.;
[0046] The adhesive layer is selected from the solvent-free adhesive produced by Fuller Company, the model is WD4120 / XR1500;
[0047] The PA layer, the barrier layer and the heat-sealing layer are co-extruded films made by a multi-layer co-extrusion process;
[0048] The thickness of the co-extruded film in this embodiment is 100 μm, the structure of the co-extruded film is PA, the barrier layer is EVOH, and the heat-sealing layer is PE.
[0049] The preparation method of a kind of printable composite molding base film of the present embodim...
Embodiment 2
[0058] The printable composite molding base film structure of this embodiment is the same as that of Embodiment 1, the difference is that,
[0059] The CPP is 50 μm;
[0060] The printing layer uses the UMT99-R boiled series ink produced by Suzhou Zhongya Ink Co., Ltd.;
[0061] The structure of the co-extruded film is PA, the barrier layer is EVOH, and the heat-sealing layer is PP, that is, the structure of the co-extruded film is PA / EVOH / PP, and the thickness of the co-extruded film in this embodiment is 130 μm.
[0062] The preparation method of the printable composite molding bottom film of this embodiment is the same as that of Example 1, the difference is that in step S2, the viscosity of the ink is 12S; the oven temperature is 45°C;
Embodiment 3
[0064] The printable composite molding base film structure of this embodiment is the same as that of Embodiment 1, the difference is that,
[0065] The CPP is 70 μm;
[0066] The structure of the co-extruded film is PA, the barrier layer is PA, and the heat-sealing layer is PE, that is, the structure of the co-extruded film is PA / PA / PE, and the thickness of the co-extruded film in this embodiment is 180 μm.
[0067] The preparation method of the printable composite molding bottom film of this embodiment is the same as that of Embodiment 1, the difference is that in step S2, the viscosity of the ink is 13S; the oven temperature is 45°C.
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Abstract
Description
Claims
Application Information
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