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Photosensitive component and method of making the same

A technology of photosensitive components and production methods, which is applied in the optical field, can solve problems such as obstacles and flexible connection belt connection methods that do not meet the development of the industry, and achieve the effect of simple and convenient connection, flexible design, and not easy to damage

Active Publication Date: 2022-07-12
NINGBO SUNNY OPOTECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Therefore, the current connection method of the conventional flexible connection belt has not satisfied the current industry development, and even created certain obstacles

Method used

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  • Photosensitive component and method of making the same
  • Photosensitive component and method of making the same
  • Photosensitive component and method of making the same

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Embodiment Construction

[0050] For a better understanding of the present application, various aspects of the present application will be described in more detail with reference to the accompanying drawings. It should be understood that these detailed descriptions are merely illustrative of exemplary embodiments of the present application and are not intended to limit the scope of the present application in any way. Throughout the specification, the same reference numerals refer to the same elements. The expression "and / or" includes any and all combinations of one or more of the associated listed items.

[0051] It should be noted that in this specification, the expressions first, second, etc. are only used to distinguish one feature from another feature and do not imply any limitation on the feature. Accordingly, the first body discussed below could also be referred to as a second body without departing from the teachings of the present application.

[0052] In the drawings, the thickness, size and...

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Abstract

The present invention provides a photosensitive assembly, comprising: a photosensitive chip, which has a first surface and a second surface opposite to the first surface, the first surface has a photosensitive area; an electronic element is arranged on the photosensitive chip around the chip; a molding part formed by a molding process and encapsulating the electronic component and the photosensitive chip together, the molding part having a third surface flush with the first surface; and a first further surface A wiring layer is formed on the non-photosensitive area of ​​the first surface and the third surface, and the pad of the photosensitive chip is electrically connected to the electronic element through the first re-wiring layer; wherein, the photosensitive component The side or bottom surface of the device has a conductive area and the conductive area is electrically connected to the first redistribution layer. The invention also provides a corresponding manufacturing method of the photosensitive component. The present invention can reduce the restriction on the design of the photosensitive component; make the camera module in the mobile terminal more modular and easy to replace.

Description

technical field [0001] The present invention relates to the field of optical technology, and in particular, the present invention relates to a photosensitive component and a manufacturing method thereof. Background technique [0002] At present, the camera module industry is becoming more and more miniaturized to meet the requirements of integration and miniaturization of current smart terminals. At present, one of the important obstacles to the miniaturization of the camera module is the printed circuit board. The current printed circuit board technology is close to the limit that it can achieve, and can no longer meet the needs of further miniaturization. [0003] In order to meet the current demand for miniaturization in the industry, the applicant proposed a solution for electrically connecting the photosensitive chip of the camera module and the electronic components together through a fan-out packaging technology (fan-out packaging). This solution replaces the circuit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L27/146
CPCH01L27/146H01L27/14601H01L27/14636H01L27/14687H01L27/14618H01L21/568H01L21/56H01L25/167H01L2224/08225H01L2224/80006H01L2924/15192H01L2924/15151H01L2924/15322H01L2924/19105H01L2224/97H01L2224/96H01L24/19H01L2224/24195H01L23/5389H01L23/49811H01L2224/80H01L23/525H01L23/528H01L23/31H01L23/481H01L23/49816H01L27/14632
Inventor 王文杰王明珠陈振宇
Owner NINGBO SUNNY OPOTECH CO LTD