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Integrated three-dimensional measurement system and measurement method

A technology of three-dimensional measurement and measurement method, applied in the field of three-dimensional measurement, can solve the problem that the three-dimensional measurement device is difficult to apply to the space-constrained environment, and achieve the effects of improving the utilization rate of light energy, simplifying the optical system, and reducing the size

Pending Publication Date: 2020-02-07
成都市众智三维科技有限公司
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Problems solved by technology

[0005] Aiming at the above-mentioned deficiencies in the prior art, the present invention provides an integrated three-dimensional measurement system that can solve the problem that the three-dimensional measurement device in the prior art is difficult to apply to a space-constrained environment

Method used

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  • Integrated three-dimensional measurement system and measurement method
  • Integrated three-dimensional measurement system and measurement method

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Embodiment Construction

[0043] The present invention will be further described below in conjunction with accompanying drawing:

[0044] Such as figure 1 As shown in , it is a schematic diagram of the structure of the integrated three-dimensional measurement system.

[0045] The integrated three-dimensional measurement system of the present invention comprises a housing 1, the top surface and the front of the housing 1 are open, and the bottom surface of the housing is respectively provided with a projection hole 16 and a camera mounting hole 15, and a CMOS camera is installed in the camera mounting hole 15; the projection hole 16 Parallel to the side of the housing 1 , the camera installation hole 15 and the projection hole 16 are inclined at an angle of 45°, so that the camera in the camera installation hole 15 can capture the reflected light emitted from the projection hole 16 onto the measured object.

[0046] Two opposite sides of the housing 1 are provided with a chute 12, the device mounting b...

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Abstract

The invention discloses an integrated three-dimensional measurement system and a measurement method. The measurement system comprises a housing, wherein the top surface and the front surface of the housing are open; a projection hole and a camera mounting hole are respectively formed in the bottom surface of the housing; a CMOS camera is mounted in the camera mounting hole; sliding grooves are formed in two opposite side surfaces of the housing; a device mounting plate is mounted on the sliding grooves; and a controller is arranged on the device mounting plate. The measurement method comprisesthe following steps: generating a phase shift structured light pattern with sinusoidal brightness changing with time by the controller, obtaining a brightness time table corresponding to the light pattern, and transmitting the brightness time table to a semiconductor laser. The problem that a three-dimensional measurement device in the prior art is difficult to be suitable for a space-limited environment can be solved, and the system is high in environmental adaptability, high in reliability and accurate in measurement.

Description

technical field [0001] The invention relates to the technical field of three-dimensional measurement, in particular to an integrated three-dimensional measurement system and a measurement method. Background technique [0002] In recent years, surface profile measurement has become increasingly important in a variety of industrial applications. In fields such as industrial design / inspection, anthropometry and biomedical applications, 3D profilometry has become one of the popular tools. Especially in the design and inspection process in the aerospace field, a compact, portable or hand-held and lightweight high-precision three-dimensional measurement system is required, which puts forward higher requirements for three-dimensional measurement. [0003] The hardware components of the three-dimensional measurement system based on active structured light mainly include structured light fringe projection equipment and image acquisition equipment. The technical solution usually ado...

Claims

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Application Information

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IPC IPC(8): G01B11/25
CPCG01B11/254
Inventor 魏永超陈锋黎新
Owner 成都市众智三维科技有限公司
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