Electromagnetic interference shielding film, circuit board and preparation method of electromagnetic interference shielding film

An electromagnetic shielding film, printed circuit board technology, applied in the field of electronics, can solve the problems of grounding failure, inability to interfere with charge export, inability to achieve shielding function, etc., to achieve the effect of shielding function
CN110769671APending Publication Date: 2020-02-07GUANGZHOU FANGBANG ELECTRONICS

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
GUANGZHOU FANGBANG ELECTRONICS
Publication Date
2020-02-07

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Abstract

The invention discloses an electromagnetic interference (EMI) shielding film, a circuit board and a preparation method of the EMI shielding film. The EMI shielding film comprises a first shielding layer, a bonding layer, a second shielding layer, a third shielding layer and an adhesive film layer, wherein the first shielding layer, the bonding layer and the second shielding layer are arranged sequentially in a stacked mode; bulges are arranged on the side, away from the bonding layer, of the second shielding layer; the third shielding layer is arranged on the side, provided with the bulges, ofthe second shielding layer, and protruding parts are formed at positions, covering the bulges, of the third shielding layer; and the adhesive film layer is arranged on the side, away from the secondshielding layer, of the third shielding layer in a covering mode. According to the EMI shielding film, the protruding parts extend into the adhesive film layer, so that when the protruding parts are press-fitted, it is guaranteed that the third shielding layer smoothly pierces through the adhesive film layer to make contact with a ground layer of the circuit board; and then, it is guaranteed thatinterference charges are normally led out under cooperation of the first shielding layer, the bonding layer, the second shielding layer and the third shielding layer, and a shielding function is achieved.
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Description

technical field

[0001] The invention relates to the field of electronics, in particular to an electromagnetic shielding film, a circuit board and a preparation method of the electromagnetic shielding film. Background technique

[0002] With the rapid development of the electronics industry, electronic products are further developed toward miniaturization, light weight, and high-density assembly, which greatly promotes the development of flexible circuit boards, thereby realizing the integration of component devices and wire connections. Flexible circuit boards can be widely used in industries such as mobile phones, liquid crystal displays, communications and aerospace.

[0003] Driven by the international market, functional flexible circuit boards dominate the flexible circuit board market, and an important indicator for evaluating the performance of functional flexible circuit boards is electromagnetic shielding (Electromagnetic Interference Shielding, referred to as EMI Sh...

Claims

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