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Cover tape and electronic component package

A technology of electronic components and cover tapes, which is applied in packaging, transportation and packaging, and packaging of fragile items, etc. It can solve the problems of not being able to fully control the floating of heat seals, and achieve the effect of suppressing floating

Active Publication Date: 2020-02-07
SUMITOMO BAKELITE CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0008] However, the cover tapes described in Patent Document 1 and Patent Document 2 cannot sufficiently control the lift-up that occurs during heat sealing.

Method used

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  • Cover tape and electronic component package
  • Cover tape and electronic component package
  • Cover tape and electronic component package

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0046] Preparation of cover tape: A biaxially stretched polyethylene terephthalate film (manufactured by Toyobo Co., Ltd., T6140) with a film thickness of 25 μm was prepared as a base material layer. Polyethylene (Wako Corporation: LM-015) was laminated as an intermediate layer on the base material layer so that the film thickness became 25 μm. After corona treatment was performed on this intermediate layer, an acrylic sealant resin (manufactured by Dainippon Ink Co., Ltd., A450A) was formed into a film so that the film thickness became 2 μm as the sealant layer, thereby obtaining figure 1 Cover tape with layer structure shown.

[0047] In addition, the measurement of the dimensional change rate of the polyethylene layer used as an intermediate|middle layer was performed by the following method. First, in an environment of 23° C. and a relative humidity of 50%, the above-mentioned polyethylene film, which is the intermediate layer, was cut into 400 mm squares. The dimension ...

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Abstract

A cover tape (10) for packaging of electronic components, provided with a substrate layer (3) and an intermediate layer (1) laminated on the one face of the substrate layer (3). A dimension of the intermediate layer (1) at 23 DEG C being T0 and the dimension thereof after two hours of heating at 80 DEG C being T1, the dimensional change rate of the cover tape (10), expressed by the following equation (1), is -4% to 4% in the flow direction (MD) and 0% to 2% in the width direction (TD) of the intermediate layer. Equation (1): Dimensional change rate (%)=[(T0 - T1) / T0]x100

Description

technical field [0001] The present invention relates to a cover tape and an electronic component package. More specifically, it relates to a cover tape capable of heat-sealing a carrier tape provided with a storage bag for transporting electronic components such as semiconductor IC chips, and a cover tape in which the electronic components are stored. The electronic component package obtained on the carrier tape. Background technique [0002] Electronic components such as semiconductor IC chips are packaged in packaging materials for anti-pollution after they are manufactured and supplied to the mounting process, and are stored and transported while being wound on paper or plastic reels. In the packaging of this electronic component, a tape-shaped packaging material is used corresponding to the mounting process on the substrate by an automatic mounting device. and a cover tape heat-sealed to the carrier tape. The electronic components packaged with such a packaging materi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B65D85/38B65D73/02
CPCB65D73/02B65D85/38
Inventor 平松正幸阿部皓基
Owner SUMITOMO BAKELITE CO LTD
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