Polishing apparatus, surface conditioning apparatus, and polishing method
A polishing device, a technology for dressing discs, applied in the directions of grinding devices, grinding/polishing equipment, abrasive surface adjustment devices, etc., can solve problems such as increasing the complexity of integrated circuits
Active Publication Date: 2020-02-11
TAIWAN SEMICON MFG CO LTD
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
However, these advances have increased the complexity of processing and manufacturing integrated circuits, and in order to achieve these advances, similar developments in integrated circuit processing and fabrication are required
Method used
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[0013] The following disclosure provides many different embodiments, or examples, configured to achieve different features of the presented subject matter. Specific examples of components and configurations are described below to simplify the present disclosure. Of course, these are examples only, not limiting. For example, forming a first feature on a second feature in the description below may include embodiments in which the first and second features are formed in direct contact, and may also include placing additional features between the first and second features. Features, such that the first feature and the second feature are not in direct contact. Additionally, the present disclosure may repeat reference numerals and / or words in various instances. This repetition does not in itself determine a relationship between the various embodiments and / or configurations discussed.
[0014] In addition, spatially relative terms such as "below," "below," "beneath," "above," "abo...
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Abstract
The present disclosure provides an apparatus and a method for polishing a semiconductor substrate in semiconductor device manufacturing. The apparatus can include: a carrier configured to hold the substrate; a polishing pad configured to polish a first surface of the substrate; a chemical mechanical polishing (CMP) slurry delivery arm configured to dispense a CMP slurry onto the first surface of the substrate; and a pad conditioner configured to condition the polishing pad. In some embodiments, the pad conditioner can include: a conditioning disk configured to scratch the polishing pad; a conditioning arm configured to rotate the conditioning disk; a plurality of magnetic screws configured to secure the conditioning disk onto the conditioning arm and including a respective plurality of screw heads; and a plurality of blocking devices respectively positioned beneath the plurality of screw heads and configured to block debris particles from entering a respective plurality of screw holes.
Description
technical field [0001] The present disclosure relates to apparatus and methods for polishing semiconductor substrates. Background technique [0002] The semiconductor integrated circuit (integrated circuit, IC) industry has experienced rapid growth. Technological advances in integrated circuit materials and design have produced several generations of integrated circuits, each with smaller and more complex circuits than the previous generation. However, these advances have increased the complexity of processing and manufacturing integrated circuits, and similar developments in integrated circuit processing and manufacturing are required to realize these advances. During the evolution of integrated circuits, functional density (ie, the number of interconnected devices per die area) has generally increased while geometry size (ie, the smallest component (or line width) that can be produced using a fabrication process) has decreased. This scaling down process often provides be...
Claims
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IPC IPC(8): B24B37/11B24B37/34B24B57/02
CPCB24B37/11B24B37/34B24B57/02B24B53/017B24B37/107H01L21/3212B24B9/065B24B37/26B24B37/24B24B37/044
Inventor 曾于平郑人豪
Owner TAIWAN SEMICON MFG CO LTD