Manufacturing process of asymmetric rigid-flex printed circuit board

A rigid-flex board, asymmetrical technology, applied in multi-layer circuit manufacturing, printed circuit manufacturing, electrical components, etc., can solve the problems of low efficiency, unfavorable long-term production, and high cost waste of traditional processes, so as to reduce production Processing flow, saving processing cost and time cost, ensuring the effect of dry film coverage

Active Publication Date: 2020-02-11
珠海杰赛科技有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] The production of such asymmetric rigid-flex boards according to the traditional production process requires at least two times of lamination and outer circuit production. The process is long and complicated, the process cost is high, and the scrap rate is high. Rigid-flex board, the cost of the process is wasteful, the traditional process is not efficient, and it is not conducive to long-term production

Method used

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  • Manufacturing process of asymmetric rigid-flex printed circuit board
  • Manufacturing process of asymmetric rigid-flex printed circuit board
  • Manufacturing process of asymmetric rigid-flex printed circuit board

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Embodiment Construction

[0034] see figure 1 , the asymmetric rigid-flex board is composed of rigid board 1, flexible board 2 and prepreg 3 according to rigid board 1, prepreg 3, rigid board 1, prepreg 3... rigid board 1, prepreg 3, flexible board 2, The prepreg 3, the rigid board 1...the prepreg 3, the rigid board 1, the prepreg 3, and the rigid board 1 are laminated in sequence. In the process of making rigid-flex boards, the purpose of opening the large cover 5 is to remove part of the rigid board 1 and the prepreg 3 on the upper and lower sides of the rigid-flex board to leak out the sub-board 7 and the small cover 4, and the purpose of opening the small cover 4 is to remove the main board 6 and the rigid board 1 and the prepreg 3 between the sub-board 7 to leak out the flexible board area 8 between the main board 6 and the sub-board 7 .

[0035] A manufacturing process of an asymmetric rigid-flex board of the present invention comprises the following steps:

[0036] S01. Perform preprocessing o...

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Abstract

The invention relates to the technical field of printed circuit board manufacturing and discloses a manufacturing process of an asymmetric rigid-flex printed circuit board. The process comprises stepsof pre-processing a rigid plate and a flexible plate; windowing two prepregs to form a first window; milling strip-shaped through holes on the rigid plate and the prepregs; windowing the prepreg to form a second window; pressing the rigid plate, the prepreg and the flexible plate by taking thickness of a main plate as a standard; drilling all holes in the positions of the main board and an auxiliary board; manually opening a large cover; carrying out pore forming; carrying out dry film coating on a semi-finished product; performing optical imaging of the main board and the auxiliary board; manufacturing outer-layer circuits of the main board and the auxiliary board; performing resistance welding; performing character jet printing; performing surface treatment; opening a small cover in a depth-controlled manner to expose a flexible plate area; performing shape processing; performing conventional subsequent processing. The process is advantaged in that at least two times of pressing inthe traditional process are optimized into one time of pressing, so the processing flow is greatly reduced, operation is simpler, the process scrap in the process flow can be effectively reduced, andprocessing cost and time cost are saved.

Description

technical field [0001] The invention relates to the technical field of printed circuit board manufacturing, in particular to a manufacturing process of an asymmetric rigid-flex board. Background technique [0002] In recent years, my country's printed circuit board (Printed Circuit Board, referred to as PCB) manufacturing industry has developed rapidly, and flexible printed circuit boards have grown rapidly, and have begun to develop in the direction of rigid-flexible printed boards. Rigid-flexible printed boards are One of the main growth points of the PCB industry in the future. [0003] With the development of rigid-flex boards, the design of asymmetric rigid-flex boards is becoming more and more common. Asymmetric rigid-flex boards, also known as primary and secondary rigid-flex boards, refer to the existence of two thicknesses in the rigid area of ​​a rigid-flex board, which are the main board and the sub-board, that is, the thickness of the rigid area is asymmetrical. ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/36H05K3/46
CPCH05K3/36H05K3/4611
Inventor 郑伟生黄德业关志锋齐国栋
Owner 珠海杰赛科技有限公司
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