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A low-temperature cutting method and device suitable for hit batteries

A technology of cutting device and cutting method, which is applied in the direction of metal processing equipment, welding equipment, manufacturing tools, etc., can solve the problems of damage, cutting efficiency loss, limiting the progress of battery development, thermal damage in the processing area, etc., to reduce deposition and improve planning. Yield rate, easy upgrade and transformation effect

Active Publication Date: 2021-10-01
上海润势科技有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, laser processing also has the defect of thermal damage in the processing area.
According to reports, the efficiency of conventional passivated emitter and rear cells (PERC cells) is reduced by about 0.1% after slicing in half, and the damage to heterojunction cells (HIT cells) is particularly serious. According to laboratory data, every cut, HIT The battery efficiency drops by more than 0.5%
The large loss of cutting efficiency severely limits the progress of HIT cells to the development of shingled technology

Method used

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  • A low-temperature cutting method and device suitable for hit batteries
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Embodiment Construction

[0057] The present invention provides a low-temperature cutting method and device suitable for HIT batteries. In order to make the purpose, technical solution and effect of the present invention clearer and clearer, the present invention will be further described in detail below with reference to the accompanying drawings and examples. It should be understood that the specific embodiments described here are only used to explain the present invention, not to limit the present invention.

[0058] It should be noted that the terms "first" and "second" in the description and claims of the present invention and the above drawings are used to distinguish similar objects, but not necessarily to describe a specific order or sequence. It should be understood that the data so used are interchangeable under appropriate circumstances. Furthermore, the terms "comprising" and "having", as well as any variations thereof, are intended to cover a non-exclusive inclusion, for example, a process...

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Abstract

The present application provides a low-temperature cutting method and device suitable for HIT batteries. The method includes: mixing a water jet beam with a laser beam, the laser beam passing through the water jet beam, and spraying out through a jet nozzle to form a water jet laser beam; The jet laser beam cuts the surface of the HIT battery according to the preset scanning path; the water jet beam sprayed by the jet nozzle scours the slag generated during processing and cools the laser processing area on the HIT battery. This application greatly reduces the efficiency loss caused by cutting to the HIT battery. The high-speed water jet beam cools the laser processing area, and scours and reduces the recasting layer, so that the surface and cross section of the HIT battery after cutting have no recasting layer. No thermal stress, no microcracks.

Description

technical field [0001] The invention relates to the field of solar cell processing, in particular to a low-temperature cutting method and device suitable for HIT cells. Background technique [0002] Because of its cleanness, safety, convenience, and high efficiency, solar photovoltaic power generation has become an emerging industry that is widely concerned and focused on development by countries all over the world. Therefore, in-depth research and utilization of solar energy resources is of great significance to alleviate the resource crisis and improve the ecological environment. [0003] HIT is the abbreviation of Heterojunction with intrinsic Thin-layer, which means intrinsic thin film heterojunction. Because HIT has been applied for as a registered trademark by Sanyo Corporation of Japan, it is also called HJT, HDT or SHJ. This type of solar cell was first successfully developed by Sanyo Corporation of Japan in 1990, when the conversion efficiency could reach 14.5% (4m...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/146B23K26/70B23K26/064B23K26/38
CPCB23K26/0648B23K26/38B23K26/146B23K26/703
Inventor 张磊段晶晶郭明波
Owner 上海润势科技有限公司
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