Magnetic field controllable sustained-release magnetic substance thickening liquid flow polishing pad and polishing method

Abstract

The invention provides a magnetic field controllable sustained-release magnetic substance thickening liquid flow polishing pad. The polishing pad is a multilayer superimposed porous wear-resistant polishing pad. Pores are reserved in the polishing pad; abrasive capsules are embedded in the holes and contain a magnetic abrasive, a thickening phase and an acid-base agent. The invention discloses a polishing method applying the magnetic field controllable sustained-release magnetic substance thickening liquid flow polishing pad. After the magnetic field is applied, the abrasive capsules in the polishing pad are subjected to the action of the magnetic field; the magnetic abrasive in the abrasive capsules impacts shells of the capsules; when the magnetic field intensity is sufficient, the capsules are broken by impact, the polishing substance is released along the pores, and is gradually dispersed and dissolved in an aqueous solution to form sustained-release magnetic substance thickening liquid flow polishing liquid. After the magnetic field is removed, the abrasive capsules stop releasing the polishing substance, and the concentration of the polishing liquid no longer changes. Duringpolishing, the magnetic field acts on the magnetic abrasive. On the basis of the thickening phase thickening liquid flow, the thickening liquid flow characteristics of the polishing liquid are furtherenhanced, and the polishing efficiency is improved. The polishing pad has long service life and high polishing efficiency.

Description

technical field [0001] The invention belongs to the technical field of ultra-precision machining, and in particular relates to a slow-release magnetic substance thickened liquid flow polishing pad with controllable magnetic field and a polishing method. Background technique [0002] Ultra-precision machining technology is an important part of modern science and technology and is widely used in many fields. For example, the processing of hard, brittle and difficult-to-machine materials such as sapphire, monocrystalline silicon, and various functional ceramics; the high precision, low damage, and aesthetics of various complex curved surfaces. Using ultra-precision machining technology, workpiece surfaces with low surface roughness, low / no surface damage or sub-surface damage can be obtained. [0003] Polishing pads are also called polishing skins, polishing cloths, polishing sheets, important auxiliary materials that determine the surface quality during the polishing process....

AI Technical Summary

Problems solved by technology

[0012] In order to overcome the problem that the existing polishing pad needs to be additionally equipped with polishing fluid during use and the polishing fluid is lost quickly during the polishing and polishing process, the present invention uses a controlled-field magnetic field slow-release polishing substance, using water (or water-soluble ) polishing; with the strengthening of the magnetic field, the higher the concentration of the polishing substance in the polishing liquid, the higher the polishing efficiency will be

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