High-speed automatic chip mounter capable of avoiding chip mounting deviation

An automatic placement machine and patch technology, which is applied in the direction of cleaning methods, electrical components, cleaning methods and utensils using gas flow, can solve the problems of patch offset and insufficient adsorption force, and avoid patch offset. , to avoid insufficient adsorption force and ensure the effect of precision

Active Publication Date: 2020-02-14
惠州市米琦科技有限公司
View PDF9 Cites 7 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a high-speed automatic placement machine that avoids placement deviation, so as to solve the above-mentioned background technology. The current high-speed automatic placement machine on the market pursues fast and accurate in use, but often suffers from Due to the low air pressure of the placement nozzle, the adsorption force is insufficient, and the placement deviation occurs.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • High-speed automatic chip mounter capable of avoiding chip mounting deviation
  • High-speed automatic chip mounter capable of avoiding chip mounting deviation
  • High-speed automatic chip mounter capable of avoiding chip mounting deviation

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0025] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0026] see Figure 1-6, the present invention provides a technical solution: a high-speed automatic chip mounter that avoids chip offset, including a device main body 1, a first motor 2, a rotating shaft 3, a first gear 4, a second gear 5, a first screw rod 6. Connection sleeve 7, first bearing 8, rotary joint sleeve 9, second motor 10, suction nozzle connecting rod 11, telescopic rod 12, mounting suction nozzle 13, first spring 14, dust collector 15, air outl...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

PUM

No PUM Login to view more

Abstract

The invention discloses a high-speed automatic chip mounter capable of avoiding chip mounting deviation, which comprises a device main body, a first gear, a connecting sleeve, a first bearing, a suction nozzle connecting rod, a surface mounting suction nozzle, a dust collection box, a workbench, a third spring, a clamping device, a PCB, an anti-deviation limiting groove and a sliding rail, whereina first motor is arranged at the side end of the device main body. The high-speed automatic chip mounter capable of avoiding chip mounting deviation is provided with the anti-deviation limiting groove and a second slide block, the anti-deviation limiting groove with the same specification is selected according to the pattern of the mounted chip, an adjusting block is moved, a second sliding blockfixedly connected with the adjusting block moves, a sliding structure is arranged between the second sliding block and the sliding rail, the anti-deviation limiting groove can be driven to horizontally move, the shape of the limiting groove is consistent with the shape of the surface-mounted element, and therefore the element to be subjected to surface mounting is pre-aligned, and the problems that due to the fact that the air pressure of the surface-mounted suction nozzle is too low, the adsorption force is insufficient, and surface-mounted deviation occurs are solved.

Description

technical field [0001] The invention relates to the technical field of placement, in particular to a high-speed automatic placement machine that avoids deviation of placement. Background technique [0002] The placement machine is a kind of equipment that places and mounts electronic components on the PCB. It is divided into two types: manual and fully automatic. [0003] High-speed automatic placement machines are common equipment on SMT production lines. High-speed automatic placement machines are needed in the processing workshops of some factories. There are many types of high-speed automatic placement machines on the market, but the current ones on the market This type of high-speed automatic placement machine pursues speed and precision when using it, but often the suction force is insufficient due to the low air pressure of the placement nozzle, and placement deviation occurs. Therefore, there is an urgent need for improvement in the market to avoid placement deviatio...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more

Application Information

Patent Timeline
no application Login to view more
Patent Type & Authority Applications(China)
IPC IPC(8): H05K13/04
CPCB08B5/04H05K13/0061H05K13/0409
Inventor 孙传保
Owner 惠州市米琦科技有限公司
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Try Eureka
PatSnap group products