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Laser processing method and laser processing device

A laser processing method and laser processing technology, which are applied in metal processing equipment, laser welding equipment, manufacturing tools, etc., can solve the problems of processing accuracy and productivity reduction, and achieve the effect of suppressing the reduction of processing accuracy and productivity

Active Publication Date: 2021-07-09
PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, at the boundary of the scanning range, there is a problem that the machining accuracy and productivity decrease due to the interface of machining traces, over machining or under machining.

Method used

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  • Laser processing method and laser processing device
  • Laser processing method and laser processing device
  • Laser processing method and laser processing device

Examples

Experimental program
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Embodiment approach

[0067] figure 1 It is a figure for the structure of the laser processing apparatus 90 which concerns on embodiment of this invention.

[0068] The laser processing method using the laser processing device 90 is to process the area (refer to Figure 4 The scanning trajectory 402 and the planned processing line 402a) of the scanning laser L are compared with the scanning area 401 of the scanning laser L (refer to Figure 4 ) A method of laser processing a large object 101 to be processed. Here, the scanning locus 402 is generated by scanning the laser light L, and the line on which the scanning locus 402 is generated is referred to as a line to be processed 402 a.

[0069] The laser processing device 90 includes at least: a driving table 102 for the object to be processed as an example of a first driving device, a laser emitting part, a galvano scanner (galvano scanner) 202, an fθ lens 203, and an example of a second driving device. The drive table and control unit 100 for sc...

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PUM

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Abstract

The present invention provides a laser processing method and a laser processing device capable of suppressing reductions in processing accuracy and productivity. The object to be processed is held on a drive table that moves in the first direction X, and then the object to be processed is moved in the first direction by driving the table, and the object to be processed is passed through the galvano scanner. The laser beam L irradiated with the fθ lens to the object is scanned by reciprocating three or more times in the first direction and the direction opposite to the first direction on the same straight line as a part of the line to be processed relative to the object. Laser scanning linear velocity V 0 Relatively fixed control, the linear velocity V in the forward and return scans 0 is the outbound scanning speed Vs 1 The difference from the moving speed Vt of the object to be processed and the return scanning speed Vs 2 The difference with the moving speed Vt, moving speed Vt=(Vs 1 ‑Vs 2 ) / 2, outbound scanning speed Vs 1 >Return scanning speed Vs 2 , scanning speed Vs>2×moving speed Vt.

Description

technical field [0001] The present invention relates to a laser processing method and a laser processing device in laser cutting processing of an object to be processed such as a resin film. Background technique [0002] Processing methods and devices for cutting, drilling, and the like of various processing objects (that is, workpieces) by laser irradiation are known. [0003] The laser processing device is mainly composed of a driving table, a galvanometer scanner, a laser oscillator, and optical system components. Generally, the irradiated laser is passed through a condenser lens, and the focus position is focused on the workpiece to perform processing. In addition, in two-dimensional machining, there is a method of scanning an arbitrary trajectory with a table having a drive shaft or a galvano scanner. [0004] For example, there is a method of scanning laser light only by a galvano scanner. In this case, the scanning speed of the galvanometric scanner is high, so the ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23K26/36B23K26/08B23K26/082
CPCB23K26/36B23K26/082B23K26/083
Inventor 恒吉拓央川西努小林勇治冈田敏幸木田胜启
Owner PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO LTD
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