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High-temperature thermal expansion performance tester for high-thermal-conductivity high-modulus carbon fibers

A technology of expansion performance and testing equipment, which is applied in the direction of thermal expansion coefficient of materials, can solve problems such as fiber breakage and failure to obtain test results of linear expansion coefficient, and achieve the effect of accurate testing

Active Publication Date: 2020-02-21
AEROSPACE RES INST OF MATERIAL & PROCESSING TECH +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This patent is only applicable to polyacrylonitrile-based and graphite-based carbon fibers. For mesophase pitch-based carbon fibers with high thermal conductivity, the fibers will break and the corresponding linear expansion coefficient test results cannot be obtained.

Method used

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  • High-temperature thermal expansion performance tester for high-thermal-conductivity high-modulus carbon fibers
  • High-temperature thermal expansion performance tester for high-thermal-conductivity high-modulus carbon fibers
  • High-temperature thermal expansion performance tester for high-thermal-conductivity high-modulus carbon fibers

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Embodiment Construction

[0032] Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited by the embodiments set forth herein. Rather, these embodiments are provided for more thorough understanding of the present disclosure and to fully convey the scope of the present disclosure to those skilled in the art. It should be noted that, in the case of no conflict, the embodiments of the present invention and the features in the embodiments can be combined with each other. The present invention will be described in detail below with reference to the accompanying drawings and examples.

[0033] Such as figure 1 As shown, the present invention provides a high-temperature thermal expansion performance test device for high-modulus and high-ther...

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Abstract

The invention discloses a high-temperature thermal expansion performance tester for high-thermal-conductivity high-modulus carbon fibers. The tester comprises a fixed platform, a laser scanning displacement measuring instrument, a furnace shell lifting device, a furnace shell, a measuring main body, a heating furnace body, a measured sample piece and a constant-temperature reference table; the furnace shell lifting device is arranged on the fixed platform, is connected with the furnace shell and can drive the furnace shell to move up and down; the laser scanning displacement measuring instrument, the furnace shell and the constant-temperature reference table are all arranged on the fixed platform; the laser scanning displacement measuring instrument, the furnace shell, the measuring main body, the heating furnace body, the measured sample piece and the constant-temperature reference table are positioned in the furnace shell lifting device; the measuring main body is positioned in the furnace shell and is connected with the heating furnace body; the measured sample piece is connected with the measuring main body; and the heating furnace body sleeves the tested sample piece. According to the device and the method, the axial linear expansion coefficient of a fiber material can be accurately tested under the condition of medium-high temperature from room temperature to 1000 DEG C.

Description

technical field [0001] The invention belongs to the technical field of thermal expansion performance testing of fibers and filamentous materials, and in particular relates to a high-temperature thermal expansion performance testing device for carbon fibers with high thermal conductivity and high modulus. Background technique [0002] Mesophase pitch-based high thermal conductivity carbon fiber has outstanding advantages such as high modulus, good stability, high thermal conductivity, small thermal expansion coefficient, and zero expansion products can be obtained. There is an urgent need for hypersonic near space vehicles, communication satellites, etc., and it has become one of the key raw materials for military use. Due to its high sensitivity, it is necessary to concentrate superior forces for special research and development. [0003] The thermal expansion performance of a material reflects the change in size of the material when it is heated (cold), and is generally ch...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N25/16
CPCG01N25/16
Inventor 冯志海何凤梅陈聪慧杨景兴刘晓龙朱世鹏李琦罗焱
Owner AEROSPACE RES INST OF MATERIAL & PROCESSING TECH
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