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Universal device for primary tin melting and secondary tin melting and using method thereof

A tin bath and tin liquid technology, applied in the secondary treatment of printed circuits, reinforcement of conductive patterns, etc., can solve the problems of increased equipment maintenance and management costs, large number of equipment, and more use of potions, etc., to save equipment costs and reduce Operator, space saving effect

Active Publication Date: 2020-02-21
江苏上达半导体有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide a general-purpose device for the first and second times of tin and its application method, so as to solve the problem in the above-mentioned background technology that the first time and the second times of tin are separated in two devices respectively. Due to the large number of equipment, the cost is high, and the cost of equipment maintenance and management is increased, and the use of liquid medicine is large, and the cost of liquid medicine is high.

Method used

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  • Universal device for primary tin melting and secondary tin melting and using method thereof
  • Universal device for primary tin melting and secondary tin melting and using method thereof

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Embodiment 1

[0020] see figure 1 , in the embodiment of the present invention, a general-purpose device for the first tinning and the second tinning, comprising a transfer roller 4 and a tinning tank 11, one side of the tinning tank 11 is fixedly provided with a first drying area 3, One side of the first drying zone 3 is fixedly provided with a pre-treatment tank 9, and the upper ends of the pre-treatment tank 9 and the tin bath 11 are fixedly provided with a conveying device 8, and the other side of the tin bath 11 is fixedly provided with a post-treatment tank 12 A second drying area 10 is fixedly arranged on one side of the aftertreatment tank 12, and the conveying equipment 8 includes a conveying roller 1, and a traction belt 2 is rollingly connected to the surface of the conveying roller 1.

Embodiment 2

[0022] see figure 1 and figure 2 , in an embodiment of the present invention, a general-purpose device usage method for the first tinning and the second tinning, comprising the following steps:

[0023] Sp1: Use the conveying roller 1 and the conveying roller 4 to drive the product 6 to the pre-treatment tank 9 for degreasing and oxidation treatment on the copper surface. After being treated in the pre-treatment tank 9, the product 6 is transferred to the first drying zone 3 for drying before tinning , the product 6 after the drying treatment in the first drying zone 3 is passed to the tin bath 11 to carry out the tin treatment for the first time;

[0024] Sp2: After the first tinning treatment, the product 6 is sent to the post-treatment tank 12 to clean the residual tin liquid to prevent discoloration of the tin surface, and the product 6 after the post-treatment tank 12 is sent to the second drying zone 10 After drying it, the first tinning can be completed;

[0025] Sp...

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Abstract

The invention discloses a universal device for primary tin melting and secondary tin melting and a using method thereof, and relates to the circuit board processing technology field. The device comprises a conveying roller and a tin melting tank. A first drying area is fixedly arranged on one side of the tin melting tank. A pretreatment tank is fixedly arranged on one side of the first drying area. Carrying equipment is fixedly arranged at upper ends of the pretreatment tank and the tin melting tank. In the invention, a carrying roller is arranged right above a processing tank and the tin melting tank, partial treatment can be selectively skipped, and tin melting time can be conveniently adjusted. Free switching between primary tin melting and secondary tin melting can be realized. The primary tin melting and the secondary tin melting can be achieved through one device, the number of the devices is reduced, device cost can be saved, and the number of the devices can be reduced so thatmanagement cost of device maintenance and the like can be decreased. An occupied area of the device is smaller than a total occupied area of two traditional devices, the space is saved, operators arereduced, and labor cost is saved.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a general-purpose device for first-time tinning and second-time tinning and a method for using the same. Background technique [0002] In the circuit board manufacturing process, in order to avoid the oxidation of the copper surface, provide the bonding between the circuit board and the parts, etc., the surface treatment of the copper surface is required. At present, there are mainly surface treatments such as OSP, gold plating, gold plating, silver plating, tin plating, and tin plating. Among them, electrolytic tin has the advantages of softness, good processability, low toxicity, low melting point, and excellent weldability. Compared with electroplating, electroless chemical immersion tin has low cost and is easy to operate. With the refinement of circuit boards, the circuit board The bendability requirements are also getting higher and higher. In tin products...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/24
CPCH05K3/24
Inventor 方磊王健孙彬沈洪李晓华
Owner 江苏上达半导体有限公司