A kind of high-performance copolyamide hot-melt adhesive composition

Abstract

The invention discloses a high-performance copolyamide hot-melt adhesive composition, which comprises 93.5-98.5% by weight of at least one copolyamide resin with a melting point range of 90-160°C, and 1.0-5.5% by weight of at least one acid An organic acid-modified petroleum resin with a value of 0.5-10 mgKOH / g, a softening point of 80-120°C and a number-average molecular weight of 300-3000, and 0.15-1.2% by weight of at least one acyl ketone metal salt; or 0.1-1 5% by weight of at least one processing aid, the total weight percentages add up to 100% by weight. In the present invention, the acyl ketone metal salt and the organic acid modified petroleum resin synergistically maintain the peeling strength of the copolyamide hot melt adhesive composition after water washing, and the decline rate is kept below 10%, and the minor damage of the copolyamide hot melt adhesive is obviously reduced. The melting peak temperature is used to accelerate its melting speed, thereby broadening the sintering process window of copolyamide hot melt adhesive powder.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a copolyamide hot-melt adhesive composition with high initial peel strength, high strength retention rate and easy processing. Background technique [0002] Copolyamides are generally obtained by copolymerization of one or more dibasic acids and one or more diamines, and / or one or more lactams, or amino acids, and are used as engineering plastics or hot-melt adhesives. Excellent heat resistance, cold resistance, electrical properties, oil resistance, chemical resistance and medium resistance, odorless, colorless and fast curing, as a hot melt adhesive, it can be applied to many common materials for bonding, and for electronic components Bonding, protection. [0003] When the copolyamide hot-melt adhesive is applied to the interlining, under the condition of meeting the initial adhesive strength (peel strength) required by the interlining, it is more necessa...

AI Technical Summary

Problems solved by technology

Patent application CN104559909A discloses a low-melting-point copolyamide hot-melt adhesive and its preparation method. The raw materials include caprolactam, nylon 66 salt, nylon 1010 salt, nylon 1012 salt, etc., and the melting point is basically above 100 degrees, which is comparable to the usual commercial products. The ratio is not significantly lower than that, and according to its structure, the sintering window is narrow, and the powder drop phenomenon is prone to occur during low-temperature sintering

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