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High-performance copolyamide hot melt adhesive composition

A technology of copolyamide and composition, which is applied in the field of copolyamide hot melt adhesive composition, can solve the problems of narrow sintering window and easy occurrence of powder drop, and achieve the effect of accelerating melting speed, good effect and not easy to separate phases

Active Publication Date: 2020-02-28
南通协鑫热熔胶有限公司 +1
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Patent application CN104559909A discloses a low-melting-point copolyamide hot-melt adhesive and its preparation method. The raw materials include caprolactam, nylon 66 salt, nylon 1010 salt, nylon 1012 salt, etc., and the melting point is basically above 100 degrees, which is comparable to the usual commercial products. The ratio is not significantly lower than that, and according to its structure, the sintering window is narrow, and the powder drop phenomenon is prone to occur during low-temperature sintering

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  • High-performance copolyamide hot melt adhesive composition
  • High-performance copolyamide hot melt adhesive composition
  • High-performance copolyamide hot melt adhesive composition

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Embodiment Construction

[0031] The technical solutions of the present invention are further explained below in conjunction with specific examples.

[0032] The following materials were used in Examples and Comparative Examples:

[0033] Copolyamide (CoPA) comes from Nantong GCL Hot Melt Adhesive Co., Ltd., which is a copolymer of PA6, PA66 and long-chain nylon. The melting point measured by DSC method is about 130.9°C.

[0034] The organic acid-modified C5 petroleum resin comes from Puyang Ruicheng Chemical Co., Ltd., the product name is RC-AG1100, the acid value is 0.8-1mgKOH / g (according to GB2895-1982 "Determination of the acid value of unsaturated polyester resin"), and the molecular weight is about 2000, with a softening point of 90-100°C, which is obtained by mixing and soaking acrylic organic acid and C5 petroleum resin and then heating and stirring.

[0035] The zinc acetylacetonate comes from Shenyang Haizhongtian Fine Chemical Factory, and is a single type of zinc acetylacetonate with a zi...

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Abstract

The invention discloses a high-performance copolyamide hot melt adhesive composition which comprises the following components in percentage by weight: 93.5-98.5% of at least one copolyamide resin witha melting point range of 90-160 DEG C, 1.0 to 5.5 wt% of at least one organic acid-modified petroleum resin having an acid value of 0.5 to 10 mgKOH / g, a softening point of 80 to 120 DEG C and a number average molecular weight of 300 to 3000, and 0.15 to 1.2 wt% of at least one acyl ketone metal salt; or also comprises 0.1-5 wt% of at least one processing aid, and the total weight percentage is 100 wt%. According to the invention, the acyl ketone metal salt and the organic acid modified petroleum resin synergistically maintain the peel strength of the copolyamide hot melt adhesive compositionafter water washing, the decrease amplitude is kept to be lower than 10%, and the secondary melting peak temperature of the copolyamide hot melt adhesive is obviously reduced to accelerate the meltingspeed, so that the sintering process window of the copolyamide hot melt adhesive powder is widened.

Description

technical field [0001] The invention belongs to the technical field of polymer materials, and in particular relates to a copolyamide hot-melt adhesive composition with high initial peel strength, high strength retention rate and easy processing. Background technique [0002] Copolyamides are generally obtained by copolymerization of one or more dibasic acids and one or more diamines, and / or one or more lactams, or amino acids, and are used as engineering plastics or hot-melt adhesives. Excellent heat resistance, cold resistance, electrical properties, oil resistance, chemical resistance and medium resistance, odorless, colorless and fast curing, as a hot melt adhesive, it can be applied to many common materials for bonding, and for electronic components Bonding, protection. [0003] When the copolyamide hot-melt adhesive is applied to the interlining, under the condition of meeting the initial adhesive strength (peel strength) required by the interlining, it is more necessa...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/00C09J157/02C09J11/06
CPCC09J11/06C09J177/00C08L57/02C08K5/0091
Inventor 苏润郁建飞施金健
Owner 南通协鑫热熔胶有限公司
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