High-performance copolyamide hot melt adhesive composition

A technology of copolyamide and composition, which is applied in the field of copolyamide hot melt adhesive composition, can solve the problems of narrow sintering window and easy occurrence of powder drop, and achieve the effect of accelerating melting speed, good effect and not easy to separate phases
CN110845987AActive Publication Date: 2020-02-28南通协鑫热熔胶有限公司 +1
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
南通协鑫热熔胶有限公司
Publication Date
2020-02-28

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Abstract

The invention discloses a high-performance copolyamide hot melt adhesive composition which comprises the following components in percentage by weight: 93.5-98.5% of at least one copolyamide resin witha melting point range of 90-160 DEG C, 1.0 to 5.5 wt% of at least one organic acid-modified petroleum resin having an acid value of 0.5 to 10 mgKOH / g, a softening point of 80 to 120 DEG C and a number average molecular weight of 300 to 3000, and 0.15 to 1.2 wt% of at least one acyl ketone metal salt; or also comprises 0.1-5 wt% of at least one processing aid, and the total weight percentage is 100 wt%. According to the invention, the acyl ketone metal salt and the organic acid modified petroleum resin synergistically maintain the peel strength of the copolyamide hot melt adhesive compositionafter water washing, the decrease amplitude is kept to be lower than 10%, and the secondary melting peak temperature of the copolyamide hot melt adhesive is obviously reduced to accelerate the meltingspeed, so that the sintering process window of the copolyamide hot melt adhesive powder is widened.
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Description

technical field

[0001] The invention belongs to the technical field of polymer materials, and in particular relates to a copolyamide hot-melt adhesive composition with high initial peel strength, high strength retention rate and easy processing. Background technique

[0002] Copolyamides are generally obtained by copolymerization of one or more dibasic acids and one or more diamines, and / or one or more lactams, or amino acids, and are used as engineering plastics or hot-melt adhesives. Excellent heat resistance, cold resistance, electrical properties, oil resistance, chemical resistance and medium resistance, odorless, colorless and fast curing, as a hot melt adhesive, it can be applied to many common materials for bonding, and for electronic components Bonding, protection.

[0003] When the copolyamide hot-melt adhesive is applied to the interlining, under the condition of meeting the initial adhesive strength (peel strength) required by the interlining, it is more necessa...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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