Semi-subtractive high-precision etching method

Abstract

The invention discloses a semi-subtractive high-precision etching method and relates to the technical field of circuit processing. The method comprises steps that Sp1, a copper foil base material is prepared, photoresist is coated on a copper foil metal layer of the copper foil base material, and exposure and development treatment are performed; Sp2, a copper foil metal layer surface is subjectedto etching treatment, and the etching thickness ranges from 5 microns to 10 microns, so etching fineness is guaranteed; Sp3, stripping treatment of the redundant photoresist on the metal layer surfaceof the copper foil is performed; and Sp4, an impedance agent is coated or attached on the metal layer surface of the copper foil. The method is advantaged in that precision of a fine circuit manufactured by the method is determined by the first coating or exposure resolution of an attached material and has nothing to do with secondary coating or the attached material, thickness of the metal layeretched for the first time is 5-10 microns, so the mature thin copper etching technology is met, precision of the circuit can be ensured, manufacturing difficulty of a thick copper fine circuit is solved, fine circuits with different thicknesses can be produced, and the increasingly developed electronic technical requirements are met.

Description

technical field [0001] The invention relates to the technical field of circuit processing, in particular to a high-precision etching method using a semi-subtractive method. Background technique [0002] With the continuous development of electronic technology, electronic products are developing in the direction of light, thin, short, small, multi-functional and high reliability. Printed circuit boards have the characteristics of high wiring density, light weight, and good heat dissipation performance, which is in line with the current development trend of electronic products, so printed circuit boards are more and more widely used. However, electronic products are becoming increasingly complex and diverse, so new requirements are placed on the circuit design of printed circuit boards. Lines affect impedance, and how to ensure the integrity of various signals (especially high-speed signals) needs to be realized through line design. Line design includes line width, line spac...

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a high-precision etching method with a half reduction method to solve the above-mentioned background technology, which is limited by the current exposure technology and etching technology, and can only make fine lines on thin copper foils, but due to electronic Products are becoming increasingly complex and diverse, and thin copper lines can no longer meet market demand

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