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Circuit board and manufacturing method thereof, and combination of circuit board and electronic component and assembly method thereof

A manufacturing method and technology of electronic components, which are applied in the directions of printed circuit manufacturing, electrical components, circuit covers, etc., can solve the problems of labor time, labor cost, low efficiency, etc., and achieve the effect of saving labor time and labor cost.

Active Publication Date: 2022-03-01
JABIL CIRCUIT GUANGZHOU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the aforementioned manual cleaning method is not only inefficient, but also easily consumes man-hours and labor costs

Method used

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  • Circuit board and manufacturing method thereof, and combination of circuit board and electronic component and assembly method thereof
  • Circuit board and manufacturing method thereof, and combination of circuit board and electronic component and assembly method thereof
  • Circuit board and manufacturing method thereof, and combination of circuit board and electronic component and assembly method thereof

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Experimental program
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Embodiment Construction

[0045]The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments.

[0046] Before the present invention is described in detail, it should be noted that in the following description, similar elements are denoted by the same numerals.

[0047] refer to figure 1 , figure 1 It is a flow chart of the steps of an embodiment of the manufacturing method of the circuit board of the present invention. The manufacturing method includes the following steps: providing the substrate step S1, exposing the step S2, and developing the step S3.

[0048] refer to figure 1 , figure 2 and image 3 , in the substrate providing step S1 , the substrate 1 has a substrate 11 , a plurality of conductive portions 12 , two copper foil layers 13 , 14 , and two photosensitive layers 15 , 16 . The substrate 11 has an insulating layer 110 composed of synthetic resin and reinforcing material. The insulating layer 110 has a first surface 111 and a...

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PUM

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Abstract

A method for manufacturing a circuit board, comprising the steps of: providing a base material, the base material has a base plate, two conductive parts and a photosensitive layer, and the conductive parts are formed with via holes; placing a photomask corresponding to the The position of the photosensitive layer, the photomask has a light-transmitting area, two first light-shielding areas, and a second light-shielding area, the photosensitive layer is exposed through the photomask, so that the photosensitive layer is divided into an exposure area and two light-shielding areas. a first unexposed area, and a second unexposed area; and developing the photosensitive layer to remove the first unexposed area and the second unexposed area, so that the exposed area forms the exposed The conductive part and the solder resist layer of a part of the substrate, the solder resist layer is formed with an opening that exposes a part of the substrate, and the opening is obtained by removing the second unexposed region in the photosensitive layer, that is, The opening is formed in a rectangular shape corresponding to a part of the area between the conductive parts.

Description

technical field [0001] The invention relates to a circuit board, in particular to a circuit board and a manufacturing method thereof, a combination of the circuit board and electronic components and an assembly method thereof. Background technique [0002] Through-hole technology is a way to mount electronic components on circuit boards. A plurality of soldering pins of the electronic components are respectively plugged into a plurality of plated through holes (PTH) of the circuit board, and then the soldering pins are welded in the plated through holes by means of wave soldering, so that the electronic components are mounted fixed on the circuit board. [0003] In the aforementioned soldering process, the solder mask layer of the circuit board will be softened by the high temperature, so that the surface roughness of the solder mask layer will be reduced. Therefore, when the solder passes through the surface of the solder mask, it is easy to produce tiny grainy solder bal...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H05K3/00H05K3/34
CPCH05K3/0082H05K3/3447H05K2203/052H05K2203/044
Inventor 王建华凡秀杰庄玉山钟仲宏
Owner JABIL CIRCUIT GUANGZHOU LTD