Bonding header assembly

Abstract

Bonding head assembly, the Y-backward base is connected with the bonding head connecting plate. The synchronous pulley of the motor on the Y forward base is connected to the synchronous pulley of the nozzle rod through the synchronous belt. The nozzle rod is rotatable in the Z-direction base. The upper and lower step pins are respectively provided with a Z-direction base and a Y-forward base, with a compression spring in between. The nozzle rod has a suction head air path, one on the surface and the other on the bottom. The nozzle rod has a chip air path, one on the surface and the other on the bottom. The rear side of the Z-direction base and the front of the forward base are connected by sliding up and down pairs. Nozzle rod and cylinder piston are fixed. Cylinder and Y are fastened to the front of the forward base. The cylinder bracket side holes are located above the piston. The Y-forward base has a contact block, and the Z-direction base has an altimetry sensor. The suction head is placed under the nozzle rod and the plate is placed on the linear motion mechanism. The tip placement plate is provided with a plurality of placement plate holes for placement of tips. Sharing a pickup and bonding head only needs to automatically switch between different suction heads to achieve the effect of picking up different types of chips.

Description

technical field [0001] The invention belongs to the field of bonding mechanisms, in particular to a bonding head assembly, in particular to a bonding head assembly in a multi-suction head automatic switching chip picking bonding mechanism. Background technique [0002] The bonding mechanism is an indispensable mechanism in the back-end packaging of integrated circuit chips. The function of the bonding mechanism is to bond the chip to the glued substrate (lead frame, ceramic substrate, glass plate, etc.) after being picked up, so as to realize the precise and tight combination of the two to meet the needs of subsequent use. Chips come from a full-size wafer, which is engraved with many circuits of predetermined size, and is subsequently divided into individual chips with circuits after a cutting process. The divided chip is still bonded to the UV film as a whole. During the working process of the machine, it is necessary to separate the independent chip from the whole throug...

AI Technical Summary

Problems solved by technology

In this way, the load driven by the actuator is relatively large, the performance required by the motor will also be greatly improved, and the manufacturing cost will increase.

Moreover, when the load is large, it is inevitable that problems such as equipment vibration will be caused due to the large inertia during the start-stop process, which will cause additional impact on the whole machine system

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