Positioning device and positioning method for faulty chip in high-density circuit board
A technology for positioning devices and circuit boards, which can be used in measuring devices, electronic circuit testing, measuring electricity, etc., and can solve problems such as failure of other components around the chip
Pending Publication Date: 2020-03-17
北京航星中云科技有限公司
View PDF0 Cites 4 Cited by
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Moreover, chip removal and soldering on the circuit board need to be completed at a certain high temperature for an appropriate time. If the location of the faulty chip is not accurate, use the elimination method to remove and solder the chip repeatedly. Multiple high-temperature operations will increase the failure of other components around the chip. risks of
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View moreImage
Smart Image Click on the blue labels to locate them in the text.
Smart ImageViewing Examples
Examples
Experimental program
Comparison scheme
Effect test
Embodiment Construction
[0026] In order to enable those skilled in the art to better understand the technical solution of the present invention, the present invention will be described in further detail below in conjunction with the accompanying drawings and specific embodiments. And the features in the embodiments can be combined with each other.
[0027] combine figure 1 with figure 2 As shown, on the one hand, an embodiment of the present invention provides a device for locating faulty chips in a high-density circuit board, including:
[0028] The detection station 1 is used to place the circuit board 11 of the faulty chip to be located. There are multiple chips connected in parallel on the same power network of the circuit board 11. The detection station 1 is provided with a circuit board limit area to prevent the circuit board 11 from shifting to ensure The thermal image generated after the subsequent thermal imaging with the thermal imager 3 corresponds to the position of the circuit board 1...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More PUM
Login to View More Abstract
The invention discloses a positioning device and positioning method for a faulty chip in a high-density circuit board. The device comprises a detection platform which is used for placing a circuit board with a faulty chip to be positioned; a direct-current power supply used for supplying power to chips under the same power supply network on the circuit board; a thermal imager, of which the imagingdirection faces the detection platform, and which is used for carrying out thermal imaging on the circuit board obtained after power supply on the detection platform; and an image analyzing and positioning module which is connected with the thermal imager, receives thermal images generated by the thermal imager, and determines the position of the faulty chip on the circuit board according to hotspots of the thermal images. Compared with an existing experience exclusion method, the method is higher in accuracy of searching the faulty chip on the circuit board; the risk of failure of other elements around the chip caused by repeated high-temperature operation due to repeated chip removal and welding is avoided; and if the resistance value of the power supply network does not return to normal after one faulty chip is removed, the operation can be repeatedly carried out to locate the next faulty chip, so that the maintenance cost of the circuit board is reduced while the working efficiency is improved.
Description
technical field [0001] The invention belongs to the technical field of integrated circuits, and in particular relates to a faulty chip positioning device and positioning method in a high-density circuit board. Background technique [0002] With the widespread application of integrated circuits, a large number of integrated chips are used in current circuit board designs. Due to the small size and multiple functions of the chips, dozens or hundreds of chips will be used in large-scale applications. For the convenience of design and cost control, as long as the output load capacity of the power supply is allowed during design, as many chips with the same working voltage as possible are connected to the same power network for centralized power supply. [0003] During the circuit board debugging process, if the output voltage exceeds the allowable working voltage range of the chip under the power supply network due to improper power supply debugging, it will inevitably break dow...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More Application Information
Patent Timeline
Login to View More Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28
CPCG01R31/2806G01R31/2813
Inventor 曹桢叶操郭晓静杨思明冯永生祖安唐彦夫陈丛笑
Owner 北京航星中云科技有限公司