Multiple input multiple output antenna apparatus

Abstract

The present invention relates to a multiple input multiple output (MIMO) antenna apparatus and, in particular, to a MIMO antenna apparatus comprising: a printed circuit board (PCB) provided with at least one heat generating element on one surface thereof; a first heat dissipation unit which is disposed to cover one surface of the PCB, has a through hole formed at a position corresponding to a position where the heat generating element is provided, and has a plurality of vertical heat dissipation fins extending in a direction orthogonal to an outer side surface thereof; and a second heat dissipation unit which is in contact with one surface of the heat generating element and is detachably coupled to the through hole so as to dissipate heat conducted by the heat generating element to a farther distance than the first heat dissipation unit. Due to these features, the multiple input multiple output (MIMO) antenna apparatus has the advantages of not only improving heat dissipation performance but also expanding the versatility of the product.

Description

technical field [0001] The present invention relates to a multiple-input multiple-output antenna device. More specifically, it relates to an antenna device that can not only directly contact a heat-generating element that generates heat to improve heat dissipation performance, but also can eliminate assembly tolerances and height deviations with peripheral components to improve universality. Multiple-input multiple-output antenna device. Background technique [0002] Wireless communication technology, for example, Multiple Input Multiple Output (MIMO, Multiple Input Multiple Output) technology is a technology that uses multiple antennas to greatly increase data transmission capacity. Appropriate signal processing to divide the received data space multiplexing (Spatialmultiplexing) method. [0003] Therefore, as the number of transmitting and receiving antennas is increased simultaneously, the channel capacity is also increased, whereby more data can be transmitted. For exa...

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Problems solved by technology

[0007] However, the heat dissipation structure of the prior art has the following problems: due to the heat dissipation pad having a predetermined thickness, contact thermal resistance will inevitably occur between the heating element and the heat dissipation body, so that it is difficult to effectively cool the components. In order to eliminate the above-mentioned assembly tolerance and height When the thickness of the heat dissipation pad is increased due to deviation, etc., there is a problem that the contact thermal resistance will further increase. In order to solve this problem, the design can be changed by increasing the height of the heat sink of the heat sink. However, by changing the design, There is also a problem that the weight and size of the product increase. In particular, in the case of high calorific value, even if the height of the heat sink fins of the heat sink is increased, the temperature of the components will not be lowered to a saturated state.

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