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Heat-Dissipating Material And Method For Producing Same, And Electronic Device And Method For Producing Same

A technology of heat dissipation materials and electronic equipment, applied in cooling/ventilation/heating transformation, semiconductor/solid-state device manufacturing, circuits, etc., can solve the problems of rising prices, heat dissipation grease and low thermal conductivity of phase change materials, etc., to reduce contact heat Excellent impedance, heat dissipation efficiency, and high heat conduction efficiency

Inactive Publication Date: 2014-04-09
FUJITSU LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] However, the thermal conductivity of thermal grease and phase change materials is low, ranging from 1W / m·K to 5W / m·K
In addition, as for indium, in addition to being a rare metal, the price of ITO-related materials needs to be greatly increased, resulting in a sharp rise in price, so it is desired to obtain lower-cost alternative materials

Method used

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  • Heat-Dissipating Material And Method For Producing Same, And Electronic Device And Method For Producing Same
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  • Heat-Dissipating Material And Method For Producing Same, And Electronic Device And Method For Producing Same

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no. 1 approach

[0040] use Figure 1 to Figure 7 , the heat dissipation material of the first embodiment and its manufacturing method will be described.

[0041] figure 1 It is a schematic sectional view showing the structure of the heat dissipation material of this embodiment. figure 2 It is a figure explaining the effect of DLC coating. image 3 and Figure 4 It is a process cross-sectional view showing the manufacturing method of the heat dissipation material of this embodiment. Figure 5 to Figure 7 It is a perspective view which shows the manufacturing method of the heat dissipation material of this embodiment.

[0042] First, use figure 1 , and the structure of the heat dissipation material of this embodiment will be described.

[0043] Such as figure 1 As shown, the heat dissipation material 22 of this embodiment has a plurality of carbon nanotubes 14 . A coating 16 of diamond-like carbon is formed on one end of the plurality of carbon nanotubes 14 . The gaps between the carb...

no. 2 approach

[0095] use Figure 8 to Figure 10 , the heat dissipation material and its manufacturing method of the second embodiment will be described. for with Figure 1 to Figure 7 Components that are the same as those of the heat dissipation material and its manufacturing method of the first embodiment shown are denoted by the same reference numerals and descriptions thereof are omitted or simplified.

[0096] Figure 8 It is a schematic sectional view showing the structure of the heat dissipation material of this embodiment. Figure 9 and Figure 10 It is a process cross-sectional view showing the manufacturing method of the heat dissipation material of this embodiment.

[0097] First, use Figure 8 , and the structure of the heat dissipation material of this embodiment will be described.

[0098] Such as Figure 8As shown, the heat dissipation material 22 of this embodiment has a plurality of carbon nanotubes 14 . A coating 16 of DLC is formed on one end of the plurality of ca...

no. 3 approach

[0112] use Figure 11 and Figure 12 , the heat dissipation material and its manufacturing method of the third embodiment will be described. for with Figure 1 to Figure 10 Components that are the same as those of the heat dissipation materials and manufacturing methods of the first and second embodiments shown are denoted by the same reference numerals and descriptions thereof are omitted or simplified.

[0113] Figure 11 It is a schematic sectional view showing the structure of the heat dissipation material of this embodiment. Figure 12 It is a process cross-sectional view showing the manufacturing method of the heat dissipation material of this embodiment.

[0114] First, use Figure 11 , and the structure of the heat dissipation material of this embodiment will be described.

[0115] Such as Figure 11 As shown, the heat dissipation material 22 of this embodiment has a plurality of carbon nanotubes 14 . A coating 16 of DLC is formed on one end of the plurality of...

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Abstract

A heat-dissipating material comprises: multiple linear structures each having a first end and a second end and composed of element carbon; a diamond-like carbon layer that covers the first ends of the multiple linear structures; and filling layers each arranged between each adjacent two of the multiple linear structures.

Description

technical field [0001] The present invention relates to a heat dissipation material having a linear structure of carbon elements, a method for manufacturing the same, an electronic device, and a method for manufacturing the same. Background technique [0002] For electronic components used in CPUs (Central Processing Units) of servers and personal computers, it is required to efficiently dissipate heat generated by semiconductor components. Therefore, these electronic components have a structure of a heat spreader made of a material having high thermal conductivity, such as copper, provided directly above the semiconductor element. [0003] At this time, since there are fine irregularities on the surfaces of the heat source and the heat sink, a sufficient contact area cannot be ensured even if they are brought into direct contact, and the contact interface becomes a large thermal resistance, which prevents efficient heat dissipation. Therefore, for the purpose of reducing c...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/373C01B31/02H05K7/20
CPCH01L2224/73253H01L23/433H05K7/2039H01L23/3732H01L23/373H01L21/50H01L2224/73204Y10T428/24851Y10T428/24802H01L21/4882H01L23/3672H01L23/3738
Inventor 山口佳孝岩井大介乘松正明崎田幸惠广濑真一八木下洋平
Owner FUJITSU LTD