Low-silicon transfer silica gel pressure-sensitive adhesive protective film

A silicone pressure-sensitive adhesive protective film and transfer layer technology, used in adhesives, epoxy resin adhesives, printing and other directions, can solve problems such as silicon pollution, and achieve strong ink adhesion, excellent adhesion, and good transfer firmness. Effect

Inactive Publication Date: 2020-03-24
SUZHOU TAILUN ELECTRONIC MATERIALS CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the silicone pressure-sensitive adhesive protective film can be applied to release layers with different peeling forces, and the use effect is good, but it is eas

Method used

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  • Low-silicon transfer silica gel pressure-sensitive adhesive protective film
  • Low-silicon transfer silica gel pressure-sensitive adhesive protective film
  • Low-silicon transfer silica gel pressure-sensitive adhesive protective film

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0021] A low-silicon transfer silicone pressure-sensitive adhesive protective film, the low-silicon transfer silicone pressure-sensitive adhesive protective film sequentially includes a low-silicon transfer layer, an adhesive layer, and a substrate layer from top to bottom, wherein the low-silicon transfer layer is by weight Contains the following ingredients:

[0022]

[0023] Among them, the preparation method of chlorotrifluoroethylene-ethyleneimine-acrylic acid fluorine-containing ester copolymer is: add 100 parts by weight of water and 150 parts by weight of fluorine-containing organic solvent to the autoclave under vacuum conditions, and then add 75 parts by weight Acrylic fluorine-containing ester monomer, 40 parts by weight of imide monomer and 1.2 parts by weight of molecular weight regulator tetrachloromethane, while stirring to raise the temperature to 60 ° C, then import 25 parts by weight of chlorotrifluoroethylene monomer, adjust After the polymerization press...

Embodiment 2

[0031] A low-silicon transfer silicone pressure-sensitive adhesive protective film, the low-silicon transfer silicone pressure-sensitive adhesive protective film sequentially includes a low-silicon transfer layer, an adhesive layer, and a substrate layer from top to bottom, wherein the low-silicon transfer layer includes by weight The following ingredients:

[0032]

[0033]

[0034] Among them, the preparation method of chlorotrifluoroethylene-ethyleneimine-acrylic acid fluorine-containing ester copolymer is: add 100 parts by weight of water and 150 parts by weight of fluorine-containing organic solvent to the autoclave under vacuum conditions, and then add 75 parts by weight Acrylic fluorine-containing ester monomer, 40 parts by weight of imide monomer and 1.2 parts by weight of molecular weight regulator tetrachloromethane, while stirring to raise the temperature to 60 ° C, then import 25 parts by weight of chlorotrifluoroethylene monomer, adjust After the polymerizat...

Embodiment 3

[0042] The raw materials and process of this embodiment are basically the same as those of Embodiment 1, the only difference is that the low-silicon transfer layer includes the following components in parts by weight:

[0043]

[0044]

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PUM

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Abstract

The invention discloses a low-silicon transfer silica gel pressure-sensitive adhesive protective film, which sequentially comprises a low-silicon transfer layer, an adhesive layer and a base materiallayer from top to bottom. Specifically, the low-silicon transfer layer comprises the following components by weight: 40-60 parts of a chlorotrifluoroethylene-ethylenimine-acrylic acid fluorine-containing ester copolymer; 20-25 parts of polyethylene glycol methacrylate; 16-18 parts of amino modified polysiloxane; 15-25 parts of imide; 10-15 parts of a fluorine-containing organic solvent; and 3-5 parts of a composite assistant. Because of a low silicon content, the low-silicon transfer silica gel pressure-sensitive adhesive protective film disclosed by the invention does not cause silicon pollution, and does not leave residue or cause a black shadow phenomenon during transfer.

Description

technical field [0001] The invention relates to a protective film, in particular to a low-silicon transfer silicone pressure-sensitive adhesive protective film. Background technique [0002] Silicone pressure sensitive adhesive is usually composed of silicone rubber, silicone resin, crosslinking agent and other components. Traditional silicone pressure-sensitive adhesive protective films are generally silicon-containing release materials, such as silicone oil, OP wax, etc. Although the silicone pressure-sensitive adhesive protective film can be applied to release layers with different peeling forces, and the use effect is good, but it is easy to have residues on the release film interface during the subsequent transfer process, and the residual silicon-containing materials are easy to cause silicon Pollution. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide a low-silicon transfer silicone pressure-sensitive adhe...

Claims

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Application Information

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IPC IPC(8): C08L33/16C08L71/02C08L83/08C08L63/10C08J5/18C09J183/04C09J163/00C09J161/06C09J129/04C09J101/12B32B27/30B32B27/28B32B27/18B32B27/06B32B7/12B32B33/00B41M5/44
CPCB32B7/12B32B27/06B32B27/18B32B27/281B32B27/283B32B27/304B32B27/308B32B33/00B32B2255/10B41M5/443B41M5/446C08J5/18C08J2333/16C08J2471/02C08J2483/08C08L2205/035C09J161/06C09J163/00C09J183/04C08L63/00C08L61/06C08L29/04C08L1/12
Inventor 叶爱磊王磊戴玮洁韩仲友谈纪金
Owner SUZHOU TAILUN ELECTRONIC MATERIALS CO LTD
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