Pressure-controlled flat plating equipment for base ring

Abstract

The invention provides pressure-controlled flat plating equipment for a base ring. The pressure-controlled flat plating equipment structurally comprises a conveyor belt, a base ring electroplating machine, an electroplating liquid input pipe, a base ring pressure-controlled flat plating device, a transparent protective baffle and a base, the conveyor belt and the base ring electroplating machine are movably connected together, and the electroplating liquid input pipe is embedded into the top end of the base ring electroplating machine to be fixedly connected with the base ring pressure-controlled flat plating device. The bottom end of a pressure-controlled flat plating nozzle and the base ring are matched and attached, a pin-up releasing mechanism is bi-directionally pressed in the downward-pressing process of a sleeve nozzle, thus the bottom end part is contracted inwards, after starting, electroplating liquid can flow onto the base ring, meanwhile a power supply is connected into thesurface of the base ring for electroplating by releasing an electroplating mechanism to make an electroplated layer be generated on the surface layer of the base ring, the electroplating liquid is evenly laid, meanwhile no other external influence factor exists, the electroplated layer is in a uniform state, and thus the screening procedure can be optimized to a great extent to decrease the reworking rate.

Description

technical field [0001] The invention belongs to the field of metal electroplating, and more specifically relates to a base ring-controlled flat plating equipment. Background technique [0002] The base is one of the main components of the voltage-controlled surface-mounted quartz crystal oscillator, and the service life of the base ring in the base has a great influence on the sealing of the base. Usually, the base ring is coated to prolong the life of the base. The service life of the seat ring, due to the small shape of the base ring, it will be placed in batches into the electroplating cylinder to complete the electroplating. [0003] Based on the above description, the inventors found that the existing pedestal ring-controlled flat plating equipment mainly has the following deficiencies, such as: [0004] Due to the large amount of feed material in the base ring in the electroplating cylinder, after the electroplating work is completed, the base ring is prone to slip du...

AI Technical Summary

Problems solved by technology

[0005] In order to solve the above-mentioned technical problems, the present invention provides a base ring controlled flat plating equipment to solve the problem that the base ring is easily damaged due to the interaction between the base ring and the Suppressing the situation of hanging and slipping, resulting in uneven welding marks and scratches on the welding surface of the base ring and uneven thickness of the welding surface, which will lead to a high rework rate and the problem that it needs to be screened before it can be used

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