One-board welding process for printed circuit board components

A welding process and assembly technology, which is applied in the field of printed board assembly single board welding process, can solve the small production batch of aerospace electronic products, the increase of single machine cost, and the inability to meet the development needs of high density and miniaturization of aerospace electronic products, etc. problem, to achieve rapid simulation optimization, miniaturization solution

Inactive Publication Date: 2012-08-01
BEIJING RES INST OF TELEMETRY
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

First of all, there are many types of aerospace electronic products and the development cycle is short. It is unacceptable to conduct a trial and error test on each printed board assembly, no matter in terms of workload or production progress; secondly, the production batch of aerospace electronic products is small and the materials The price is expensive, and the inpu

Method used

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  • One-board welding process for printed circuit board components
  • One-board welding process for printed circuit board components
  • One-board welding process for printed circuit board components

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0057] Example 1:

[0058] 1. Basic conditions

[0059] 1.1 Printed Board

[0060] In terms of the thickness of the printed circuit board, the current limit thickness of the printed circuit board of our company is 0.8mm and 3.0mm. The thickness of the commonly used printed circuit board is 1.6mm, 1.8mm, 2.0mm, 2.2mm, 2.4mm. Therefore, the above seven thicknesses are selected for experimentation to study the influence of the thickness of the printed circuit board on the solder joint temperature.

[0061] In terms of the number of layers of printed circuit boards, usually the use limit of printed circuit boards is 2 layers and 20 layers. The number of printed circuit boards is 10 layers as the mainstream. Therefore, in the choice of the number of printed circuit boards, two-layer, 10-layer and 20-layer boards were selected for testing to consider the contribution of the number of printed circuit boards to the solder joint temperature.

[0062] In terms of area selection of printed cir...

Example Embodiment

[0102] Example 2:

[0103] 1. Basic conditions

[0104] 1.1 Printed Board

[0105] Analyzing the commonly used thickness of printed circuit boards, on the basis of the original first batch of printed circuit boards, further influence weight subdivision tests were carried out on the four thicknesses of 1.8mm, 2.0mm, 2.2mm, and 2.4mm.

[0106] 1.2 Solder and flux

[0107] Same as "First Embodiment"

[0108] 1.3 Production and testing tools and equipment

[0109] Same as "First Embodiment"

[0110] 2. Process implementation steps

[0111] 2.1 Temperature measurement point setting

[0112] There are 4 printed circuit board installation temperature test points for 10-1.8, 10-2.0, 10-2.2, 10-2.4. The temperature measurement point setting is the same as the "first embodiment".

[0113] 2.2 Silkscreen

[0114] Same as "First Embodiment"

[0115] 2.3 Reflow soldering

[0116] Same as "First Embodiment"

[0117] 2.4 Test data and analysis

[0118] A total of 36 groups of 288 actual welding temperature curv...

Example Embodiment

[0140] Example 3:

[0141] 1. Basic conditions

[0142] 1.1 Printed Board

[0143] Use 2a-3, 10m-3, 10b-3, 10-1.8, 10-2.0, 10-2.2, 10-2.4 printed circuit boards.

[0144] 1.2 Solder and flux

[0145] Same as "First Embodiment"

[0146] 1.3 Production and testing tools and equipment

[0147] Same as "First Embodiment"

[0148] 1.4 Components

[0149] 1) Types of components (welding end form)

[0150] In the selection of component types, the research group based on the typical packaged components commonly used in our institute, and selected resistance-capacitance components, QFP packaged devices, QFN packaged devices, and BGA packaged devices as test components.

[0151] The resistance-capacitance components are selected from 0603, 0805, and 1812 packages;

[0152] QFP selects 100-pin, 240-pin plastic and metal shell packaged devices;

[0153] QFN selects the most commonly used 20-pin plastic packaged device;

[0154] BGA selects 100ball, 484ball, 672ball, 896ball, 1020ball plastic package and met...

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Abstract

The invention relates to a one-board welding process for printed circuit board components. A large number of experiments conducted confirm that the welding spot temperature is mainly affected by thickness of bare boards of printed circuit boards and quality of elements of the printed circuit boards. Based on the law that when the set temperature of every temperature zone of a reflow oven is increased by a value, the obtained actual temperature curve and the original temperature curve are basically unchanged, a simulation optimization method of oven temperature setting-up parameters is summed up. When the one-board welding process for the printed circuit board components is applied to passage printed circuit board components, measured temperature curves of cold spots and hot spots of board surfaces of the passage printed circuit board components meet requirements of the lead-containing reflow welding, shapes of the welding spots are good, and electrical performance of the assembling unit before and after experiment is normal when temperature impact experiment is used for testing the quality of the welding spots. By the one-board welding process for the printed circuit board components, the rapid simulation optimization of process parameters is realized, the production efficiency of aerospace electronic products and the product percent of pass are greatly improved and the hidden quality dangers are eliminated, so that the one-board welding process for the printed circuit board components plays a very active role in guaranteeing the quality and the reliability of products.

Description

technical field [0001] The invention relates to the technical field of electronic assembly, in particular to a single-board welding process of a printed board assembly. Background technique [0002] The surface mount production line (SMT line) is mainly composed of a screen printing machine (Stencil printer), a pick&place machine (Pick&Place machine), and a reflow oven (Reflow oven). The reflow soldering process (Reflow soldering process) realized in the reflow oven is an extremely important process on the SMT production line, and is the key to controlling the quality of SMT production. The control of the reflow soldering process determines the final quality of the SMT production line products. If the control of the reflow process is unreasonable, the process control of the early printed circuit board design, solder paste printing and component placement will lose meaning. [0003] Reflow soldering process control is technically expressed as the control of the reflow solder...

Claims

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Application Information

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IPC IPC(8): H05K3/34
Inventor 何伟刘芳曲双稳齐凤海
Owner BEIJING RES INST OF TELEMETRY
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