Miniature light-emitting diode display panel and manufacturing method thereof

A technology of light-emitting diodes and display panels, applied to static indicators, instruments, electrical components, etc., can solve the problems of metal wire printing and alignment in mobile printing, and achieve high-precision effects

Active Publication Date: 2020-03-24
BOE TECH GRP CO LTD +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At present, when performing this process, it is necessary to grind off the vertical edge at an angle (45°~60°) after laser cutting into a small size, so that the

Method used

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  • Miniature light-emitting diode display panel and manufacturing method thereof
  • Miniature light-emitting diode display panel and manufacturing method thereof
  • Miniature light-emitting diode display panel and manufacturing method thereof

Examples

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Example Embodiment

[0070] In the above-mentioned manufacturing method of the micro light-emitting diode display panel, specifically, the method of forming the one-to-one corresponding openings and the metal thin film connecting portions of the signal lines in the predetermined edge area can have the following three specific implementation modes:

[0071] In a specific implementation manner, the openings and the metal film connection portions corresponding to the signal lines are formed in the predetermined edge area. The specific steps may be, for example, Figure 7 , Figure 8a-Figure 8d Shown:

[0072] S701: A plurality of through holes corresponding to the signal lines are formed one-to-one in the predetermined edge area, and the centers of the plurality of through holes are on the same cutting line; specifically, as Figure 8a As shown, in the structure formed in this step, the predetermined edge area of ​​the base substrate 1 has through holes 5 corresponding to the signal lines 3 one-to-one;

[00...

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Abstract

The invention discloses a miniature light-emitting diode display panel and a manufacturing method thereof, and the display panel comprises a substrate which comprises a first surface and a second surface which are opposite to each other; a micro light-emitting diode and a driving circuit are arranged on the substrate, the driving circuit comprises a plurality of signal lines located on the first surface of the substrate and signal leads which are located on the second surface of the substrate and correspond to the signal lines one to one, and the ends of the signal lines and the ends of the signal leads extend to a preset edge area of the substrate; holes which are arranged in the preset edge area and correspond to the signal lines one to one, and a metal film connecting part, the holes penetrate through the substrate, each metal film connecting part at least comprises a first metal film connecting part plated on the side wall of the corresponding hole, and the two ends of each metal film connecting part are connected with the corresponding signal line and the corresponding signal lead respectively. According to the display panel, the signal line and the signal lead can be accurately aligned and connected, and the metal film connecting part is prevented from being broken.

Description

technical field [0001] The invention relates to the technical field of display devices, in particular to a micro light-emitting diode display panel and a manufacturing method thereof. Background technique [0002] Micro LED display panels include miniaturized and matrixed micro LED arrays, which have the characteristics of ultra-high pixel count, ultra-high resolution, low energy consumption, and long life. Compared with organic electroluminescent (OLED) display panels, micro-LED display panels can reduce the distance between pixels from mm to μm, and have a high color gamut. [0003] The micro-LED display panel achieves super-large-size display through splicing. The current structure of the micro-LED display is limited by the size limit of the massive transfer of micro-LEDs on the substrate, and it is necessary to prepare a complete front and back process on the substrate. Finally, high-precision laser cutting is carried out to ensure that the thermal damage is as small as...

Claims

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Application Information

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IPC IPC(8): H01L25/16H01L25/00H01L27/12G09G3/32
CPCH01L25/167H01L25/50H01L27/1214G09G3/32H01L33/62H01L2933/0066H01L25/0753H01L27/156H01L33/44H01L2933/0025
Inventor 齐永莲杨虹曲连杰张珊赵合彬
Owner BOE TECH GRP CO LTD
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