A device for separating and recycling waste copper clad laminates

Abstract

The invention discloses a waste copper-clad laminate separation and recovery device, which belongs to the technical field of electronic waste recovery, and includes a mounting frame, a feeding and conveying assembly, a feeding and conveying assembly, a clamping and scraping assembly, a feeding and pushing assembly, and a crushing assembly. The mounting frame is arranged on the ground, the feeding and conveying assembly and the unloading conveying assembly are symmetrically arranged at both ends of the mounting frame, the clamping and scraping off assembly is arranged in the mounting frame, and the The clamping and scraping assembly is located between the loading and conveying assembly and the unloading conveying assembly, the unloading pushing assembly is arranged on the mounting frame, and the unloading pushing assembly is located between the unloading and conveying assembly On the side of the assembly, the crushing assembly is arranged on the side of the installation frame. The invention solves the problems in the prior art that waste copper clad laminates are usually directly crushed and then sorted to recover the metal copper therein, and the remaining resin substrate fragments are directly buried, which seriously wastes resources and at the same time has the risk of polluting the soil.

Description

technical field [0001] The invention relates to the technical field of recycling electronic waste, in particular to a device for separating and recycling waste copper clad laminates. Background technique [0002] Copper-clad laminates are made of paper and glass fiber cloth and other substrates, impregnated with resin, and made into adhesive sheets (adhesive paper and adhesive cloth). After combining several adhesive sheets, one or both sides are equipped with copper foil. Pressure curing, made of plate products. It is the basic material for making PCB (printed circuit board), and is widely used in electronic products such as televisions, computers, computers, mobile communication equipment and household appliances. With the rapid development of electronic technology, the demand for raw copper-clad laminates has increased sharply. The mass-scale production process has produced about 20% of scraps, and about 120 million square meters need to be processed; the upgrading of el...

AI Technical Summary

Problems solved by technology

With the rapid development of electronic technology, the demand for raw copper-clad laminates has increased sharply. The mass-scale production process has produced about 20% of scraps, and about 120 million square meters need to be processed; the upgrading of electronic products has accelerated and a large number of waste plating Tin copper clad laminates, if they are stacked for a long time without treatment, there will be great environmental and safety hazards

On the other hand, the content of precious metals such as copper and tin in many waste copper-clad laminates is as high as 20-30%, which is much higher than that of ordinary metal mines; and the production of new resin substrates requires a lot of fossil raw materials

[0003] In the prior art, waste copper-clad laminates are usually directly crushed and then sorted to recover the metal copper in them. The remaining resin substrate fragments are directly buried, which is a serious waste of resources and has the risk of polluting the soil.

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