The invention belongs to the technical field of
electronic waste recycling, and particularly discloses a method for
tin dissolving and
desoldering of a waste circuit board, which comprises the following steps of: carrying out dust removal treatment on the waste circuit board by adopting a high-pressure blower gun; preparing a
hydrochloric acid solution for
desoldering; putting the waste circuit board into a closed glass reaction kettle, and injecting a
hydrochloric acid solution into the closed glass reaction kettle; dissolving and soaking the waste circuit board, and mechanically stirring in the whole process; and respectively taking out the component and the substrate, washing with clear water,
drying, and collecting the de-
soldering tail liquid. The
desoldering tail liquid is subpackaged, and
centrifugal separation is carried out after subpackaging; and upper-layer waste liquid is poured out of the separated sealing-off
tail liquid,
neutralization treatment is conducted, lower-layer
solid matter is recycled, and the
welding flux is obtained. By the adoption of the
tin dissolving and desoldering method for the waste circuit board, rapid separation of ECs and a substrate (PWB) can be achieved,
tin-lead solder on the waste circuit board can be removed in an environment-friendly and efficient mode, and convenience is provided for further
resource utilization.