Method for preparing metal powder with low iron content by treating a waste circuit board component through mechanical physical method

A technology for waste circuit boards and metal powders is applied in the field of electronic waste recycling, which can solve the problems of high cost, serious environmental pollution, and large energy consumption.

Inactive Publication Date: 2021-06-25
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, pyroprocessing consumes a lot of energy, is costly, and causes serious environmental pollution.

Method used

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  • Method for preparing metal powder with low iron content by treating a waste circuit board component through mechanical physical method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] Use a heat gun to disassemble components from waste desktop computer circuit boards at 450°C. Various components were taken in proportion for component analysis and determination. The comprehensive results are as follows: iron content is 22.93% (nearly one of which is elemental), copper content is 32.65% (of which eight is elemental), aluminum content is 8.53%, silicon The content is 26.92%.

[0027] Such as figure 1 As shown in the process flow, the disassembled desktop computer components are initially crushed with a shear crusher, and then sieved with a 5mm sieve to obtain copper (accounting for 33.49% of the total copper), aluminum (accounting for 85.83% of the total amount of aluminum) mainly on the sieve metal particles, and under the sieve metal and non-metal mixed particles.

[0028] The metal and non-metal mixed particles under the sieve are crushed for the second time by a universal crusher to obtain a mixed powder with a particle size of 0.5mm, and then the...

Embodiment 2

[0030] Use a heat gun to disassemble components from waste laptop circuit boards at 400°C. Various components were taken in proportion for component analysis and determination. The comprehensive results are as follows: iron content is 23.59% (less than one of which is elemental), copper content is 33.28% (nearly nine of which is elemental), and aluminum content is 7.37%. , the silicon content is 29.32%.

[0031] Such as figure 1As shown in the process flow, the dismantled waste notebook computer components are initially crushed by a shear crusher, and then sieved by a 5mm sieve to obtain copper (accounting for 35.37% of the total amount of copper), aluminum ( Accounting for 87.49% of the total amount of aluminum) mainly on the sieve metal particles, and under the sieve metal and non-metal mixed particles. The metal and non-metal mixed particles under the sieve are crushed for the second time by a universal crusher to obtain a mixed powder with a particle size of 0.5mm, and t...

Embodiment 3

[0034] Use a heat gun to disassemble components from waste TV circuit boards at 350°C. Various components were taken in proportion for component analysis and determination. The comprehensive results are as follows: iron content is 20.46% (nearly 10% of which), copper content is 35.71% (nearly 90% of which is elemental), aluminum content is 8.52%, silicon The content is 27.84%.

[0035] Such as figure 1 As shown in the process flow, the dismantled waste TV components are initially crushed with a shear crusher, and then sieved with a 5mm sieve to obtain copper (accounting for 37.72% of the total amount of copper), aluminum ( Accounting for 90.62% of the total amount of aluminum) mainly on the sieve metal particles, and under the sieve metal and non-metal mixed particles.

[0036] The metal and non-metal mixed particles under the sieve are crushed for the second time by a universal crusher to obtain a mixed powder with a particle size of 0.5mm, and then the metal powder and non...

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Abstract

The invention discloses a method for preparing metal powder with low iron content by treating a waste circuit board component through a mechanical physical method, and belongs to the technical field of electronic waste recycling. According to the method, firstly, a heat gun is used for disassembling the component, a small part of nonmetal is carbonized in the process, and therefore a part of metal and nonmetal in the component are separated to facilitate subsequent metal dissociation; then, primary crushing and screening are carried out by utilizing the metal ductility difference, and a part of copper with high ductility and most aluminum are separated from iron with low ductility; next, secondary crushing and screening are conducted on materials obtained through primary crushing and screening, and therefore metal is completely dissociated; high-grade metal powder and non-metal powder are efficiently separated through electrostatic separation; then, ferromagnetic metal and non-magnetic metal are separated from the metal powder with high iron content through a magnetic separation process; and finally, the ferromagnetic metal powder is ball-milled to obtain fine-grained metal powder with low iron content (mainly containing copper and precious metal).

Description

technical field [0001] The invention belongs to the technical field of resource recycling of electronic waste, and relates to a method for preparing metal powder with low iron content by treating waste circuit board components with a mechanical physical method. Background technique [0002] Printed circuit boards are the foundation of the electronics industry. They exist in mobile phone boards, TV boards, audio equipment boards, tablet PC boards, camera boards, LED boards, etc. There are many types and huge quantities. There are many kinds of components on waste circuit boards, mainly composed of polymers, resins, glass fibers and various metal components. Due to the continuous development of science and technology and the continuous improvement of people's pursuit of the functions of electronic products, the replacement cycle of electronic products is getting shorter and shorter, and the number of electronic products has increased sharply, resulting in an increasing amount ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B09B3/00B09B5/00
CPCB09B3/00B09B5/00Y02W30/82
Inventor 俞嘉梅王志辉刘功起王维
Owner BEIJING UNIV OF TECH
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