Feed network device and antenna

Abstract

The invention relates to a feed network device and an antenna. The feed network device comprises a feed network plate, a cover plate and a support column. Aa feed network line is arranged on the surface of one side of the feed network plate. The cover plate is connected with the feed network plate through the support columns, and a first grounding metal layer is arranged on the side surface, facing the feed network plate, of the cover plate. The feed network line faces the first grounding metal layer, and a gap is arranged between the feed network line and the first grounding metal layer. Airbetween the feed network plate and the cover plate is used as a medium, and an air microstrip mode is adopted, so that the cost can be reduced. The supporting columns can control the distance betweena feed network line and the ground, it is guaranteed that a traditional feed network device can be simulated, and the good performance of the traditional feed network device is reserved. Compared witha traditional feed network device of a four-layer plate structure, the thickness of the feed network device can be reduced due to the fact that the number of layers is reduced, and therefore the lowprofile can be achieved, and the physical space size can be reduced under the condition that it is guaranteed that indexes are qualified.

Description

technical field [0001] The invention relates to the technical field of communication, in particular to a feeding network device and an antenna. Background technique [0002] In the coverage of mobile communication networks, the 5G Massive MIMO antenna is one of the key devices of the coverage network, and the gain of the antenna depends on the loss of the feeding network. Since the dielectric loss tangent of the dielectric material determines the loss of the power divider of the feed network device, PCB boards with low dielectric loss are the research focus of major board manufacturers. [0003] A general feeding network device uses a high-frequency PCB (specifically made of PTFE) as a power divider and is placed on the bottom plate. The high-frequency PCB usually includes an upper layer, an intermediate line layer, and a lower layer arranged in sequence. The PP dielectric layer is bonded to the base plate, and the high-frequency PCB board and the base plate are connected t...

AI Technical Summary

Problems solved by technology

Among them, PTFE has a low dielectric constant and low dielectric loss, making it the preferred high-frequency PCB material, but the cost is high; in addition, the dielectric loss tangent of the lower-cost epoxy resin board is 10 times that of ordinary materials, and the dielectric loss The electric constant deviation is large, so it cannot be used to make a feed network device

Images