Aging method of optical module COC

Abstract

The invention relates to an aging method of an optical module COC (Chip On Chip), which comprises the following steps of: electrifying the optical module to ensure that the COC emits light and is actively coupled with a lens, and confirming that the light passing through the lens is coupled into the optical fiber by monitoring optical fiber output optical power; writing a preset test program intothe optical module before aging, powering on the optical module, and aligning the detector with a light outlet of the optical fiber to test performance parameters before aging; writing a preset agingprogram into the optical module, installing the optical module on an aging board, and putting the aging board into an aging environment; writing the aged optical module into a preset test program, andtesting aged COC performance parameters by aligning a detector with an optical fiber light outlet; and comparing related performance parameter changes before and after aging, and screening early failure COCs. According to the invention, the COC is electrically connected with the power supply optical module, the COC is aged by powering up the two ends of the optical module, the related performanceparameters of the optical module are tested and combined with the aging of the module, the cost of a COC fixture is saved, the test efficiency is improved, and the working hours are reduced.

Description

technical field [0001] The invention relates to the technical field of optical communication, in particular to an aging method of an optical module COC. Background technique [0002] With the rapid development of 5G communication and the increasing demand of data centers, the market demand for multiplexing optical modules such as 100G and 400G is increasing. Various electronic components COC (Chip On Carrier, chip on substrate or chip on chip) used in optical modules usually need to be aged to screen out COCs that fail early, so as to ensure the long-term reliability of COC applied to optical modules. There are two common packaging forms of TOSA (Transmitter Optical Subassembly): TO package and BOX (housing) package. The disadvantage of the TO package is that the current speed is not high, so for some high-speed devices, it is still necessary to choose the BOX package. BOX packaging, also known as deep cavity packaging, is superior to TO packaging in terms of transmission ...

AI Technical Summary

Problems solved by technology

[0009] The invention provides an aging method of an optical module COC, which solves the problems of high test cost (aging fixture), low test efficiency and accuracy, and the aging of the optical module on the aging fixture in the prior art. Technical problems with large surface damage of components

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