Unlock instant, AI-driven research and patent intelligence for your innovation.

High-weldability anti-warping thick film conductor paste for stainless steel base material and preparation method of high-weldability anti-warping thick film conductor paste

A technology of conductive paste and stainless steel, applied in the direction of conductive materials dispersed in non-conductive inorganic materials, cable/conductor manufacturing, electrical components, etc., can solve the problem of incomplete contact between thick-film conductors and electronic parts, and reduce the reliability of thick-film conductors Solderability, incomplete contact and other problems, to achieve the effect of inhibiting corrosion, excellent compatibility, and improving adhesion

Active Publication Date: 2020-04-07
广东顺德弘暻电子有限公司
View PDF8 Cites 2 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] As one of the methods for preventing the erosion phenomenon, there is a method of increasing the content of glass powder in the thick film conductor, or floating the glass component on the surface of the obtained thick film conductor; At the same time, the weldability of thick film conductors is greatly reduced, and there are incomplete contacts between thick film conductors and electronic parts, or incomplete contact between detectors for measuring the characteristic values ​​of electronic parts and thick film conductors. question

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] This stainless steel substrate is made of highly weldable and anti-warping thick film conductor paste, including 78% by weight of composite conductive powder, 4% of composite lead-free glass powder, and 18% of organic carrier; the composite conductive powder is spherical Mixed powder of silver powder and spherical palladium powder; composite lead-free glass powder is CaO-Al 2 o 3 -SiO 2 -B 2 o 3 -Li 2 O series lead-free glass powder and Bi 2 o 3 -CuO-MnO 2 -Al 2 o 3 -SiO 2 It is a composite powder of lead-free glass powder.

[0032] Further, the weight ratio of silver powder to palladium powder is 95:5.

[0033] Further, the average particle size of the silver powder is 2.0 μm, and the specific surface area is 3~5m 2 / g; the average particle size of palladium powder is 300nm, and the specific surface area is 20~40m 2 / g.

[0034] Further, CaO-Al 2 o 3 -SiO 2 -B 2 o 3 -Li 2 O-based lead-free glass powder includes 22% CaO and 10% Al by weight 2 o 3 ,...

Embodiment 2

[0046] The thick film conductor paste involved in this embodiment is different from the first embodiment in that: the thick film conductor paste includes 80% by weight of composite conductive powder, 1% of composite lead-free glass powder, and 19% of organic Carrier; the composite conductive powder is a mixed powder of spherical silver powder and spherical palladium powder; the composite lead-free glass powder is CaO-Al 2 o 3 -SiO 2 -B 2 o 3 -Li 2 O series lead-free glass powder and Bi 2 o 3 -CuO-MnO 2 -Al 2 o 3 -SiO 2 It is a composite powder of lead-free glass powder.

[0047] Further, the weight ratio of silver powder to palladium powder is 98:2.

[0048] Further, the average particle size of the silver powder is 2.0 μm, and the specific surface area is 3~5m 2 / g; the average particle size of palladium powder is 300nm, and the specific surface area is 20~40m 2 / g.

[0049] Further, CaO-Al 2 o 3 -SiO2 -B 2 o 3 -Li 2 O-based lead-free glass powder includes ...

Embodiment 3

[0055] The thick film conductor paste involved in this embodiment is different from the first embodiment in that: the thick film conductor paste includes 81% by weight of composite conductive powder, 3% of composite lead-free glass powder, and 16% of organic Carrier; the composite conductive powder is a mixed powder of spherical silver powder and spherical platinum powder; the composite lead-free glass powder is CaO-Al 2 o 3 -SiO 2 -B 2 o 3 -Li 2 O series lead-free glass powder and Bi 2 o 3 -CuO-MnO 2 -Al 2 o 3 -SiO 2 It is a composite powder of lead-free glass powder.

[0056] Further, the weight ratio of silver powder to platinum powder is 96:4.

[0057] Further, the average particle size of the silver powder is 2.0 μm, and the specific surface area is 3~5m 2 / g; the average particle size of platinum powder is 300nm, and the specific surface area is 20~40m 2 / g.

[0058] Further, CaO-Al 2 o 3 -SiO 2 -B 2 o 3 -Li 2 O-based lead-free glass powder includes 2...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
specific surface areaaaaaaaaaaa
specific surface areaaaaaaaaaaa
particle sizeaaaaaaaaaa
Login to View More

Abstract

The invention relates to high-weldability anti-warping thick-film conductor paste for a stainless steel base material and a preparation method of the high-weldability anti-warping thick-film conductorpaste. The thick-film conductor paste is characterized by comprising the following components in percentage by weight: 75-85% of composite conductive powder, 1-5% of composite lead-free glass powderand 15-20% of organic carrier; the composite conductive powder is mixed powder of silver powder and palladium powder or platinum powder; and the composite lead-free glass powder is the composite powder of CaO-Al<2>O<3>-SiO<2>-B<2>O<3>-Li<2>O series lead-free glass powder and Bi<2>O<3>-CuO-MnO<2>-Al<2>O<3>-SiO<2> series lead-free glass powder. The thick-film conductor paste is high in reliability and good in stability.

Description

technical field [0001] The invention relates to the field of thick-film electronic paste, in particular to a high-solderable and anti-warping thick-film conductor paste for stainless steel substrates and a preparation method thereof. Background technique [0002] Thick-film hybrid circuits, chip resistors, resistor networks, and thick-film heating elements all need to be soldered on thick-film conductors during the manufacturing process or installation process. During soldering, sometimes Ag melts into the solder, and the conductor part disappears or even breaks. This phenomenon becomes erosion; The yield rate of the heating element becomes the cause of reducing the reliability of these electronic parts. [0003] In order to prevent environmental pollution, the solder is also changing from 63Sn / 37Pb eutectic solder to lead-free solder with high Sn content. Since Sn-based solder has a high melting point, there is a tendency for the soldering temperature to increase. Since t...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22H01B13/00C03C12/00C03C3/064
CPCC03C3/064C03C12/00H01B1/22H01B13/00
Inventor 高丽萍肖海标尤柏贤潘名俊
Owner 广东顺德弘暻电子有限公司