Heating plate for MOCVD reaction chamber

Abstract

The invention discloses a heating plate for an MOCVD reaction chamber. The heating plate for the MOCVD reaction chamber comprises an even number of a plurality of groups of heating pieces; all heatingpieces are in centrosymmetric arrangement; the shape of each group of the heating pieces is an arc shape which is round about extended outwards from a centre point O; the roundabout inflection pointof adjacent groups of the heating pieces are staggered with each other; and the free ends of each group of the heating pieces are respectively connected to the two poles of a power supply. The heatingplate for the MOCVD reaction chamber has the beneficial effects that the defect of the structure of the conventional heating plate is overcome, the stability of use is improved, and the service lifeof the heating plate is prolonged by changing from axial symmetry into central symmetry, changing an omega-shaped centre of the heating plate into a separately split or closed annular structure, and reasonably arranging the installation of an indwelling area and a voltage position.

Description

technical field [0001] The invention relates to MOCVD equipment, in particular to a heating plate for an MOCVD reaction chamber. Background technique [0002] During the growth of semiconductor chips, the uniformity of the temperature field is highly required. Therefore, a heating plate with uniform heating and long service life plays a vital role in the production of semiconductor chips. [0003] Through retrieval, a heating sheet is disclosed in the patent name: A tungsten-coated heating sheet for MOCVD equipment and its preparation method (CN106756891B), but this heating sheet is not suitable for the semiconductor field due to the hollow structure in the center Chip growth used. [0004] At present, the structure of the heating plate used in chip growth is as follows figure 1 As shown, in the middle is a heat arc plate 1 with a shape of Ω. Two sets of arc heat plates 2 are respectively connected on both sides of the heat arc plate 1. The two sets of arc heat plates 2 ar...

AI Technical Summary

Problems solved by technology

[0011] In order to solve the following three technical problems: 1. The overall deformation of the traditional heating plate after heating, resulting in a local short circuit; 2. In order to ensure stable heating of the traditional heating plate, the electrodes of the axisymmetric heating plate are on the same side, which is prone to short circuit hazards; 3. The traditional heating plate The unreasonable distribution of the heating plate retention area leads to uneven heating, and it is easy to cause local deformation and other problems

Images