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Device and method for measuring deformation of flexible electronic devices in vacuum variable temperature environment

A technology of flexible electronic devices and measuring devices, which is applied in the direction of measuring devices, measuring electricity, and measuring electrical variables, etc., which can solve the limitations of test results and ignore the use of working conditions, etc.

Active Publication Date: 2021-09-07
NORTHEASTERN UNIV LIAONING
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the traditional testing of flexible electronic devices is generally a test at a constant temperature, that is, the test is carried out after setting a certain temperature threshold, which ignores the operating conditions under variable temperature conditions, resulting in obvious limitations in test results

Method used

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  • Device and method for measuring deformation of flexible electronic devices in vacuum variable temperature environment
  • Device and method for measuring deformation of flexible electronic devices in vacuum variable temperature environment

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Embodiment Construction

[0028] The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

[0029] Such as figure 1 , 2 As shown, a flexible electronic device deformation measurement device in a vacuum variable temperature environment includes a vacuum chamber 1, a specimen bending mechanism 2, an electric heating tube 3, a cooling tube 4 and a heat sink cylinder 5; the vacuum chamber 1 adopts a cylinder Shaped structure, the vacuum chamber 1 is set horizontally, and a telescopic sliding table 6 is installed horizontally inside the vacuum chamber 1, and the bending and twisting mechanism 2 of the test piece is arranged on the telescopic sliding table 5; the heat sink tube 5 is fixed concentrically on the Inside the vacuum chamber 1, the telescopic sliding table 6 and the specimen bending and twisting mechanism 2 are located inside the heat sink tube 5; the electric heating tube 3 is spirally wound and sleeved on the outer w...

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Abstract

A device and method for measuring the deformation of flexible electronic devices in a vacuum variable temperature environment. The device includes a vacuum chamber, a test piece bending and twisting mechanism, an electric heating tube, a cooling tube, and a heat sink tube; The mechanism is set on the telescopic slide table; the heat sink tube is installed in the vacuum chamber, and the telescopic slide table and the bending and torsion mechanism of the specimen are located inside the heat sink tube; the cooling tube and the electric heating tube are respectively spirally wound and set inside the heat sink tube On the wall; a nitrogen input pipe is provided in the vacuum chamber. The method is: vapor-deposit interdigitated electrodes on the surface of the flexible electronic device; clamp the flexible electronic device into the bending mechanism of the test piece; close the vacuum chamber; set the bending speed, bending angle, bending times, pressure and temperature Pre-temperature and temperature after temperature change; vacuumize; start the electric heating tube until it reaches the temperature before the temperature change; bend the flexible electronic device and start the refrigeration tube until it reaches the temperature after the temperature change; fill nitrogen to return to normal pressure and normal temperature; take out the flexible electronic device .

Description

technical field [0001] The invention belongs to the technical field of testing flexible electronic devices, and in particular relates to a deformation measuring device and method for flexible electronic devices in a vacuum variable temperature environment. Background technique [0002] In recent years, people's demand for portability, flexibility, and wearability of electronic products has become higher and higher, which has effectively promoted the rapid development of flexible electronic technology. Flexible electronic devices, with their unique flexibility and ductility, have been used in many industries including Information, energy, medical and many other fields are widely used. [0003] At present, the temperature factor has always been an unavoidable factor for flexible electronic devices. Changes in temperature will have a significant impact on the conductivity, limit voltage, limit current, and switching characteristics of flexible electronic devices, especially in ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G01R31/00G01N3/20
CPCG01N3/20G01N2203/0023G01N2203/0067G01R31/00
Inventor 李建昌亓帅帅于培伦
Owner NORTHEASTERN UNIV LIAONING
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