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Laser cutting splitting device

A laser cutting and laser cutting technology, which is applied to laser welding equipment, welding equipment, metal processing equipment, etc., can solve the problems of poor slitting effect, large space occupation, and complex structure, so as to reduce labor intensity, compact layout, and improve The effect of processing efficiency

Inactive Publication Date: 2020-04-17
SHENZHEN INTE LASER TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In order to solve the problems of complex structure, large space occupation and poor splitting effect in the prior art, the present invention provides a laser cutting splitting device with a simple and compact structure, which does not take up too much space and is convenient for splitting thicker products

Method used

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Embodiment Construction

[0021] Such as Figure 1 to Figure 5 As shown, the present invention discloses a laser cutting splitting device, comprising a feeding mechanism 1, a conveying mechanism 5, a laser cutting mechanism 2, a laser splitting mechanism 3 and a blanking mechanism 4, the laser cutting mechanism 2 and the laser splitting mechanism Mechanisms 3 are arranged side by side, the feeding mechanism 1 is arranged on one side of the laser cutting mechanism 2, and the unloading mechanism 4 is arranged on the side of the laser split mechanism 3, and its structure is more compact and will not take up too much space. space, the feeding mechanism 1 includes a conveying platform and a conveying belt arranged on the upper end of the conveying platform, which can be directly connected to the glass processing platform, and can be directly connected to the device for cutting and splitting after the glass is manufactured. The conveying mechanism 5 includes a transmission beam and a suction plate 51 that ca...

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Abstract

The invention provides a laser cutting splitting device. The laser cutting splitting device comprises a feeding mechanism, a conveying mechanism, a laser cutting mechanism, a laser splitting mechanismand a discharging mechanism, wherein the laser cutting mechanism and the laser splitting mechanism are arranged in parallel, the laser splitting mechanism comprises a splitting laser head, and a spray head used for spraying water is arranged on one side of the lower end of the splitting laser head; a splitting bearing is arranged at the upper end of a splitting bearing platform; a splitting jig is arranged at the upper end of the splitting bearing, wherein a silica gel fireproof cloth layer is arranged on the upper surface of the splitting jig; and the discharging mechanism comprises a firstdischarging conveying sliding way, a second discharging conveying sliding way and a discharging mechanical arm capable of horizontally moving. The laser cutting splitting device is simple in structureand compact in layout without occupying too much space; large-breadth glass with larger thickness can be can better cracked through arranging the spray head, and the processing quality is guaranteed;and the device is convenient to control and capable of reducing the labor intensity of operators as well as greatly improving the processing efficiency, and low manufacturing cost can be achieved.

Description

technical field [0001] The invention relates to the field of glass cutting and breaking, in particular to a laser cutting and breaking device. Background technique [0002] The current large-format glass cutting device has a complex structure, a large volume, takes up a lot of space, and the cutting mechanism is complicated. Moreover, when the glass is thicker, it will often appear uncracked during laser slitting, which will affect the entire slitting effect. , thus affecting the processing progress, and when the large-format glass is cut into pieces, the jig cannot effectively limit the glass at a high level, and it is easy to shift the position of the jig and affect the splinter effect. Contents of the invention [0003] In order to solve the problems of complex structure, large space occupation and poor slitting effect in the prior art, the present invention provides a laser cutting slitting device with simple and compact structure, which does not occupy too much space ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/36B23K26/38B23K26/70B23K26/146B23K26/14
CPCB23K26/36B23K26/38B23K26/146B23K26/1462B23K26/70B23K26/703
Inventor 邹武兵张德安曾健明
Owner SHENZHEN INTE LASER TECH
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