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Method for improving bonding strength of laser cladding coating and substrate based on reinforcement of binding nails

A technology of laser cladding and bonding strength, which is applied in coating, metal material coating process, etc., can solve the problems of cladding layer exclusion, coating contains bubbles, coating and substrate are not strongly bonded, etc., to prevent falling off And cracking, improve the effect of bonding strength

Inactive Publication Date: 2020-04-17
JIANGSU UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] However, due to the extremely fast melting and solidification speeds of laser cladding technology, it is difficult to remove all the pores in the cladding layer. Therefore, the coating may contain air bubbles after cladding, resulting in weak bonding between the coating and the substrate, resulting in The coating is easy to fall off, etc.

Method used

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  • Method for improving bonding strength of laser cladding coating and substrate based on reinforcement of binding nails
  • Method for improving bonding strength of laser cladding coating and substrate based on reinforcement of binding nails
  • Method for improving bonding strength of laser cladding coating and substrate based on reinforcement of binding nails

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Embodiment Construction

[0023] In the following, the specific implementation techniques of the present invention will be described in more detail in conjunction with the examples, so the protection scope of the present invention cannot be limited by this.

[0024] The technical mode of concrete implementation of the present invention is:

[0025] The method for improving the bonding strength of the laser cladding coating and the substrate based on the pinning strengthening mode includes the following steps:

[0026] 1) Carry out pretreatment to matrix H13;

[0027] 2) Process conical nailing holes on the substrate, and the size of the small holes is Large hole size is The positions of the holes are evenly distributed on the center line of symmetry parallel to the long side of the substrate, and the number of holes is 3; the sum of the areas of the holes at the small diameter ends of the conical nailing holes accounts for 15% of the surface of the substrate.

[0028] Machining cylindrical exhaust...

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Abstract

The invention belongs to the technical field of laser processing, and particularly relates to a method for improving bonding strength of a laser cladding coating and a substrate based on the reinforcement of binding nails. The method comprises the following steps of 1) pretreating a substrate; 2) processing conical nail holes on the substrate; 3) processing cylindrical exhaust holes on the substrate; and 4) filling the conical nail holes with the cladding material for laser cladding. According to the method, the bonding strength of the laser cladding coating and the substrate can be improved,and the air can be better prevented from overflowing, so that the coating is prevented from falling off and cracking.

Description

technical field [0001] The invention belongs to the technical field of laser processing, and in particular relates to a method for improving the bonding strength of a laser cladding coating and a substrate based on a nailing strengthening mode. Background technique [0002] With the development of the times, molds are used in more and more fields. However, the mold will continue to be worn during use, which will eventually lead to mold failure. There are usually three types of mold failure, namely: wear failure, fracture failure and plastic deformation failure. They will shorten the service life of the mold, so how to extend the use of the mold Lifespan becomes a question worthy of study. [0003] At present, most of the laser cladding technology is used to improve the service life of the mold. Laser cladding technology refers to the use of preset powder spreading or synchronous powder feeding to clad different coating powders on the substrate, and then after high Energy l...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C23C24/10
CPCC23C24/103
Inventor 陈炜刘博姚辉彭玉春
Owner JIANGSU UNIV