A method for preparing nail head bumps and nail head bumps
A bump and nail head technology, which is applied in the field of nail head bump preparation, can solve the problems of low nail head bump height and narrow application range, and achieve the effect of increasing stacking spacing, expanding application range, and increasing height
Active Publication Date: 2021-10-15
THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP
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- Abstract
- Description
- Claims
- Application Information
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Problems solved by technology
[0005] In view of this, the present invention provides a method for preparing stud bumps and stud bumps, to solve the problem that the stud bumps prepared by existing methods have a narrow application range due to their low height
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[0027] In the following description, specific details such as specific system structures and technologies are presented for the purpose of illustration rather than limitation, so as to thoroughly understand the embodiments of the present invention. It will be apparent, however, to one skilled in the art that the invention may be practiced in other embodiments without these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present invention with unnecessary detail.
[0028] In order to make the purpose, technical solution and advantages of the present invention clearer, specific embodiments will be described below in conjunction with the accompanying drawings.
[0029] Nailhead bump is a kind of metal bump. Compared with other bump manufacturing methods, nailhead bump welding has the advantages of no need to make an under-bump metallization layer on the electr...
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Abstract
The invention is applicable to the technical field of flip chips, and provides a method for preparing nail head bumps and the nail head bumps. Wherein, the method includes: melting a first metal ball at the tail end of the metal wire; welding the first metal ball to a preset position on the carrier to form a first bump; connecting the metal wire and the A second metal ball is melted at the joint of the first bump, and the second metal ball is welded on the first bump to form a second bump; disconnecting the metal wire from the second bump point connection, forming stud bumps including the first bumps and the second bumps at preset positions on the carrier. The stud bumps prepared by the method provided by the present invention have a certain height, so that the stud bumps can also be better applied in the 3D stacking and integration of high-frequency chips, thereby expanding the application range of the stud bumps.
Description
technical field [0001] The invention belongs to the technical field of flip chips, and in particular relates to a method for preparing nail head bumps and nail head bumps. Background technique [0002] With the continuous extension of Moore's Law, the size of chip technology devices is getting smaller and smaller, and integrated circuit chips have a higher degree of integration. However, when the size of the device reaches the deep submicron scale, it becomes more and more difficult to further reduce it. The research on chip design begins to develop in a three-dimensional direction, and chip stack packaging technology appears. [0003] Most of the traditional chip stacking interconnection technologies use wire bonding, solder bump flip-chip bonding, metal bump flip-chip bonding, etc. Among them, metal bump (such as nail head bump) flip-chip bonding is due to its small bump diameter. , The process conditions are simple, and it is more and more widely used. [0004] However,...
Claims
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IPC IPC(8): H01L21/60H01L23/488
CPCH01L24/11H01L24/13H01L2224/11005H01L2224/11015H01L2224/1111H01L2224/11334H01L2224/78301
Inventor 杨彦锋王磊徐达张延青张卫青赵瑞华刘帅王凯冯涛陈然韩玉鹏刘乐乐
Owner THE 13TH RES INST OF CHINA ELECTRONICS TECH GRP CORP